EPF10K200SRC240-1N vs EPF10K200SRC240-3N Comparison

Detailed side-by-side comparison of EPF10K200SRC240-1N by Intel and EPF10K200SRC240-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SRC240-1N EPF10K200SRC240-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $68.40 $162.00
Family FLEX 10KE FLEX 10KE
Series EPF10K200 β€”
Logic Elements / Cells 9,984 β€”
Equivalent Gates 200,000 β€”
Logic Array Blocks (LABs) 1,248 1,248
Number of I/Os 182 β€”
Supply Voltage (Core) 2.5 V β€”
Maximum Operating Frequency 250 MHz β€”
Process Technology 0.22 Β΅m CMOS 0.22 Β΅m CMOS SRAM
Package 240-BFQFP Exposed Pad (RQFP-240) 240-pin RQFP (Power QFP) with exposed pad, 34.6 x 34.6 mm, 0.5 mm pitch
Mounting Type Surface Mount Surface Mount
Configuration Memory SRAM-based β€”
Embedded Array Blocks (EABs) Yes 24
Operating Temperature Grade Commercial β€”
RoHS Status Compliant [DATA_NEEDED: RoHS status]
MSL Level [DATA_NEEDED: MSL Level] β€”
Typical System Gates β€” 200,000
Logic Elements (LEs) β€” 9,984
Maximum Logic Elements β€” 9,984
Maximum User RAM Bits β€” 98,304
User I/Os β€” 470 (effective); 182 user pins per RQFP-240 with the rest assigned to dedicated functions
Propagation Delay (tPD) β€” 0.40 ns
Internal Operating Frequency β€” 166.67 MHz
Core Supply Voltage β€” 2.5 V
MultiVolt I/O Support β€” 2.5 V and 3.3 V interfaces
Operating Temperature β€” 0 Β°C to +70 Β°C (Commercial)
JTAG Support β€” IEEE Std 1149.1 Boundary-Scan (contributes up to 31,250 gates of test logic)
Configuration Method β€” SRAM-based; requires external configuration device (e.g., EPC2) for power-up loading
Speed Grade β€” -3 (commercial)

Datasheets & Resources

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