EPF10K200SRC240-1N vs EPF10K200SRC240-3N Comparación
Comparación detallada lado a lado de EPF10K200SRC240-1N por Intel y EPF10K200SRC240-3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K200SRC240-1N | EPF10K200SRC240-3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $68,40 | $162,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Series | EPF10K200 | — |
| Logic Elements / Cells | 9,984 | — |
| Equivalent Gates | 200,000 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Number of I/Os | 182 | — |
| Supply Voltage (Core) | 2.5 V | — |
| Maximum Operating Frequency | 250 MHz | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS SRAM |
| Encapsulado | 240-BFQFP Exposed Pad (RQFP-240) | 240-pin RQFP (Power QFP) with exposed pad, 34.6 x 34.6 mm, 0.5 mm pitch |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Memory | SRAM-based | — |
| Embedded Array Blocks (EABs) | Yes | 24 |
| Operating Temperature Grade | Commercial | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Nivel MSL | [DATA_NEEDED: MSL Level] | — |
| Typical System Gates | — | 200,000 |
| Logic Elements (LEs) | — | 9,984 |
| Maximum Logic Elements | — | 9,984 |
| Maximum User RAM Bits | — | 98,304 |
| User I/Os | — | 470 (effective); 182 user pins per RQFP-240 with the rest assigned to dedicated functions |
| Propagation Delay (tPD) | — | 0.40 ns |
| Internal Operating Frequency | — | 166.67 MHz |
| Core Supply Voltage | — | 2.5 V |
| MultiVolt I/O Support | — | 2.5 V and 3.3 V interfaces |
| Temperatura de funcionamiento | — | 0 °C to +70 °C (Commercial) |
| JTAG Support | — | IEEE Std 1149.1 Boundary-Scan (contributes up to 31,250 gates of test logic) |
| Configuration Method | — | SRAM-based; requires external configuration device (e.g., EPC2) for power-up loading |
| Speed Grade | — | -3 (commercial) |