EPF10K20RC240-3 vs EPF10K20RC240-4 Comparison
Detailed side-by-side comparison of EPF10K20RC240-3 by Intel and EPF10K20RC240-4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K20RC240-3 | EPF10K20RC240-4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Family | FLEX 10K | FLEX 10K |
| Series | FLEX-10K® | — |
| Typical Gates | 20,000 | 20,000 |
| Logic Elements (LEs) | 12,288 | — |
| Logic Array Blocks (LABs) | 189 | 144 |
| Flip-Flops | 1,152 | — |
| Embedded Array Blocks (EABs) | 6 (2 Kbit each) | — |
| Total EAB RAM | 12 Kbits | — |
| User I/Os | 470 (max per package) | 189 |
| Package | 240-BFQFP Exposed Pad (RQFP-240) | 240-BFQFP Exposed Pad (RQFP) |
| Process Technology | 0.42 µm CMOS, 5 metal layers | 0.42 µm CMOS |
| Core Supply Voltage (VCCINT) | 5 V | — |
| I/O Supply Voltage (VCCIO) | 3.3 V or 5 V tolerant | — |
| Propagation Delay (tpd) | 0.4 ns | — |
| Maximum Internal Frequency | 125 MHz | — |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to 70 °C |
| Speed Grade | -3 | -4 |
| Configuration Interface | JTAG (IEEE 1149.1) + serial configuration PROM | — |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL Level] |
| RoHS Status | unknown (legacy Altera part, likely non-RoHS) | non_compliant (legacy BFQFP, SnPb finish) |
| Programming | SRAM-based, in-system reconfigurable | — |
| Logic Elements / Cells | — | 1,152 |
| Pin Count | — | 240 |
| Supply Voltage | — | 5 V |
| Propagation Delay | — | 0.4 ns (per DigChip) |
| Embedded Memory | — | EAB (Embedded Array Block) SRAM/ROM |