EPF10K250EFC672-1 vs EPF10K130EFC672-2 Comparison

Detailed side-by-side comparison of EPF10K250EFC672-1 by Intel and EPF10K130EFC672-2 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K250EFC672-1 EPF10K130EFC672-2
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete NRND
Family FLEX 10KE FLEX 10KE
Logic Family CMOS —
Typical System Gates 250,000 —
Maximum User I/Os 470 413
Total Pins 672 —
Package Type BGA-672 —
Package Size 45 x 45 mm —
Ball Pitch 1.27 mm —
Package Shape Square —
Terminal Form Ball —
Operating Temperature 0C to +70C (Commercial) 0 °C to +70 °C (Commercial)
Propagation Delay 0.4 ns —
Programming Technology In-system, SRAM-based —
RoHS Status [DATA_NEEDED: RoHS status] —
Mounting Type Surface Mount Surface Mount (BGA)
Configuration Interface Serial (passive/active) —
Speed Grade -1 -2
Logic Elements / Cells — 6,656
Total Gates — ~130,000
Logic Array Blocks (LABs) — 832
Embedded Memory (RAM bits) — 65,536
Number of I/O Pins — 672 (package pins)
Package — 672-ball FineLine BGA
Process Technology — 0.22 µm CMOS
Core Supply Voltage — 2.5 V
Propagation Delay (typ.) — 0.6 ns
Internal Operating Frequency (max) — 333.33 MHz
Programming Method — SRAM-based, JTAG (IEEE 1149.1)

Datasheets & Resources

Browse All Products Create BOM Request Quote