EPF10K250EFC672-1 vs EPF10K130EFC672-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EFC672-1 sa pamamagitan ng Intel at EPF10K130EFC672-2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K250EFC672-1 | EPF10K130EFC672-2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Family | CMOS | — |
| Typical System Gates | 250,000 | — |
| Maximum User I/Os | 470 | 413 |
| Total Pins | 672 | — |
| Package Type | BGA-672 | — |
| Package Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Temperature na Operasyon | 0C to +70C (Commercial) | 0 °C to +70 °C (Commercial) |
| Propagation Delay | 0.4 ns | — |
| Programming Technology | In-system, SRAM-based | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration Interface | Serial (passive/active) | — |
| Speed Grade | -1 | -2 |
| Logic Elements / Cells | — | 6,656 |
| Total Gates | — | ~130,000 |
| Logic Array Blocks (LABs) | — | 832 |
| Embedded Memory (RAM bits) | — | 65,536 |
| Number of I/O Pins | — | 672 (package pins) |
| Packhaging | — | 672-ball FineLine BGA |
| Process Technology | — | 0.22 µm CMOS |
| Core Supply Voltage | — | 2.5 V |
| Propagation Delay (typ.) | — | 0.6 ns |
| Internal Operating Frequency (max) | — | 333.33 MHz |
| Programming Method | — | SRAM-based, JTAG (IEEE 1149.1) |