EPF10K250EFC672-1 vs EPF10K200EFC672-1 Comparison
Detailed side-by-side comparison of EPF10K250EFC672-1 by Intel and EPF10K200EFC672-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EFC672-1 | EPF10K200EFC672-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Last Time Buy |
| Family | FLEX 10KE | FLEX-10KE |
| Logic Family | CMOS | — |
| Typical System Gates | 250,000 | — |
| Maximum User I/Os | 470 | — |
| Total Pins | 672 | — |
| Package Type | BGA-672 | — |
| Package Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Operating Temperature | 0C to +70C (Commercial) | 0 C to 70 C (Commercial) |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Programming Technology | In-system, SRAM-based | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Interface | Serial (passive/active) | — |
| Speed Grade | -1 | -1 |
| Logic Elements | — | 9,984 |
| Typical Gates | — | 200,000 |
| User I/Os | — | 470 |
| Embedded Memory (bits) | — | 98,304 |
| Logic Array Blocks (LABs) | — | 1,248 |
| Package | — | 672-FBGA (FineLine BGA), 27x27 mm, 1.27 mm pitch |
| Process Technology | — | CMOS, SRAM-based |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, True-LVDS |
| Core Voltage | — | 2.5 V (typical, FLEX-10KE) |
| Supply Voltage - Max | — | 3.3 V (I/O) |
| MSL Level | — | 3 (168 hours) |