EPF10K250EFC672-1 vs EPF10K200EFC672-1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EFC672-1 sa pamamagitan ng Intel at EPF10K200EFC672-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K250EFC672-1 | EPF10K200EFC672-1 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | FLEX 10KE | FLEX-10KE |
| Logic Family | CMOS | — |
| Typical System Gates | 250,000 | — |
| Maximum User I/Os | 470 | — |
| Total Pins | 672 | — |
| Package Type | BGA-672 | — |
| Package Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Temperature na Operasyon | 0C to +70C (Commercial) | 0 C to 70 C (Commercial) |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Programming Technology | In-system, SRAM-based | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Interface | Serial (passive/active) | — |
| Speed Grade | -1 | -1 |
| Logic Elements | — | 9,984 |
| Typical Gates | — | 200,000 |
| User I/Os | — | 470 |
| Embedded Memory (bits) | — | 98,304 |
| Logic Array Blocks (LABs) | — | 1,248 |
| Packhaging | — | 672-FBGA (FineLine BGA), 27x27 mm, 1.27 mm pitch |
| Process Technology | — | CMOS, SRAM-based |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, True-LVDS |
| Core Voltage | — | 2.5 V (typical, FLEX-10KE) |
| Supply Voltage - Max | — | 3.3 V (I/O) |
| Level ng MSL | — | 3 (168 hours) |