EPF10K30EFC256-2N vs EPF10K30EFC256-1X Comparison

Detailed side-by-side comparison of EPF10K30EFC256-2N by Intel and EPF10K30EFC256-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30EFC256-2N EPF10K30EFC256-1X
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $48.57 $95.60
Series FLEX 10KE β€”
Family FLEX 10KE Embedded Programmable Logic Family FLEX 10KE
Typical Gates 30,000 30,000
Logic Elements (LEs) 1,728 β€”
Embedded RAM Bits 24,576 β€”
Embedded Array Blocks (EABs) 6 β€”
User I/Os 246 β€”
Logic Cells 1728 β€”
Propagation Delay 0.6 ns (per digchip listing; internal frequency 80 MHz) β€”
Number of Logic Elements 24576 β€”
Operating Temperature 0 Β°C to +70 Β°C (Commercial) 0 Β°C to +70 Β°C (commercial)
Supply Voltage [DATA_NEEDED: core and I/O rail voltages] β€”
Process Technology 0.22 Β΅m CMOS, SRAM-based 0.22 Β΅m CMOS
Package 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA)
Mounting Type Surface Mount β€”
Configuration Passive Serial / Active Serial / JTAG β€”
Lead Free / RoHS Non-RoHS (legacy, SnPb finish per FBGA-256 family) β€”
Speed Grade -2N (mid-grade, 0.6 ns) -1X (fastest commercial)
Logic Elements β€” 1728
Logic Array Blocks (LABs) β€” 216
Embedded Memory (EAB RAM) β€” 24,576 bits (6 EABs of 4 Kbit each)
User I/O β€” 176
Maximum Internal Frequency β€” 250 MHz
Propagation Delay (tpd) β€” 0.4 ns to 0.6 ns
Core Supply Voltage β€” 2.5 V
MultiVolt I/O Support β€” 2.5 V / 3.3 V / 5 V
Configuration Method β€” SRAM, JTAG (IEEE 1149.1)
Phase-Locked Loops β€” 4
Compliance β€” RoHS (check distributor for specific lot), Pb-free option available

Datasheets & Resources

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