EPF10K30EFC256-2N vs EPF10K30EFC256-1X 比較
詳細並排比較 EPF10K30EFC256-2N 由 Intel 與 EPF10K30EFC256-1X 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N ObsoleteIntel
EPF10K30EFC256-1X - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel / Altera
EPF10K30EFC256-1X Obsolete規格比較
| 參數 | EPF10K30EFC256-2N | EPF10K30EFC256-1X |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Series | FLEX 10KE | — |
| Family | FLEX 10KE Embedded Programmable Logic Family | FLEX 10KE |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements (LEs) | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| User I/Os | 246 | — |
| Logic Cells | 1728 | — |
| Propagation Delay | 0.6 ns (per digchip listing; internal frequency 80 MHz) | — |
| Number of Logic Elements | 24576 | — |
| 工作溫度 | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (commercial) |
| 供應電壓 | [DATA_NEEDED: core and I/O rail voltages] | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.22 µm CMOS |
| 封裝 | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) |
| 安裝類型 | Surface Mount | — |
| Configuration | Passive Serial / Active Serial / JTAG | — |
| Lead Free / RoHS | Non-RoHS (legacy, SnPb finish per FBGA-256 family) | — |
| Speed Grade | -2N (mid-grade, 0.6 ns) | -1X (fastest commercial) |
| Logic Elements | — | 1728 |
| Logic Array Blocks (LABs) | — | 216 |
| Embedded Memory (EAB RAM) | — | 24,576 bits (6 EABs of 4 Kbit each) |
| User I/O | — | 176 |
| Maximum Internal Frequency | — | 250 MHz |
| Propagation Delay (tpd) | — | 0.4 ns to 0.6 ns |
| Core Supply Voltage | — | 2.5 V |
| MultiVolt I/O Support | — | 2.5 V / 3.3 V / 5 V |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1) |
| Phase-Locked Loops | — | 4 |
| Compliance | — | RoHS (check distributor for specific lot), Pb-free option available |