EPF10K30EFC256-3 vs EPF10K50EFC256-3 Comparison

Detailed side-by-side comparison of EPF10K30EFC256-3 by Intel and EPF10K50EFC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30EFC256-3 EPF10K50EFC256-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Family FLEX 10KE FLEX 10KE
Typical Gates 30,000 50,000
Logic Elements / Cells 1,728 2880
Logic Array Blocks (LABs) 216 360
Embedded RAM Bits 24,576 —
User I/O Pins 176 —
Maximum Operating Frequency 200 MHz —
Process Technology 0.22 micrometer CMOS 0.42 µm CMOS, SRAM-based
Core Supply Voltage (VCCINT) 2.5 V —
I/O Supply Voltage (VCCIO) 3.3 V (multi-voltage I/O standard support) —
Package 256-ball FineLine BGA 256-pin FineLine BGA (FBGA-256)
Mounting Type Surface Mount (BGA) —
Speed Grade -3 (fastest) -3
Temperature Grade Commercial —
Configuration Interface Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Embedded Array Blocks (EABs) — 10
Total Embedded Memory — 40,960 bits
Maximum User I/Os — 191
Core Voltage (VCCINT) — 2.5 V
I/O Tolerance — 5.0 V (MultiVolt I/O interface)
Internal Frequency (max) — 166.67 MHz
Propagation Delay (typical) — 0.6 ns
Operating Temperature — 0 °C to +70 °C (Commercial)
JTAG Support — IEEE Std. 1149.1 Boundary-Scan
Programming Method — In-system SRAM, JTAG or EPC configuration device

Datasheets & Resources

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