EPF10K30EFC256-3 vs EPF10K50EFC256-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-3 sa pamamagitan ng Intel at EPF10K50EFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K50EFC256-3 - 50K Gates FLEX 10KE FPGA, 256-BGA | Intel / Altera
EPF10K50EFC256-3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K30EFC256-3 | EPF10K50EFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 30,000 | 50,000 |
| Logic Elements / Cells | 1,728 | 2880 |
| Logic Array Blocks (LABs) | 216 | 360 |
| Embedded RAM Bits | 24,576 | — |
| User I/O Pins | 176 | — |
| Maximum Operating Frequency | 200 MHz | — |
| Process Technology | 0.22 micrometer CMOS | 0.42 µm CMOS, SRAM-based |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| I/O Supply Voltage (VCCIO) | 3.3 V (multi-voltage I/O standard support) | — |
| Packhaging | 256-ball FineLine BGA | 256-pin FineLine BGA (FBGA-256) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Speed Grade | -3 (fastest) | -3 |
| Temperature Grade | Commercial | — |
| Configuration Interface | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Embedded Array Blocks (EABs) | — | 10 |
| Total Embedded Memory | — | 40,960 bits |
| Maximum User I/Os | — | 191 |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Tolerance | — | 5.0 V (MultiVolt I/O interface) |
| Internal Frequency (max) | — | 166.67 MHz |
| Propagation Delay (typical) | — | 0.6 ns |
| Temperature na Operasyon | — | 0 °C to +70 °C (Commercial) |
| JTAG Support | — | IEEE Std. 1149.1 Boundary-Scan |
| Programming Method | — | In-system SRAM, JTAG or EPC configuration device |