EPF6010ANTC100-2 vs EPF6010ATC100-3 Comparison
Detailed side-by-side comparison of EPF6010ANTC100-2 by Intel and EPF6010ATC100-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF6010ANTC100-2 - FLEX 6000 FPGA, 880 LEs, 71 I/O, 100-TQFP | Intel
EPF6010ANTC100-2 ⚠ Last Time BuySpecification Comparison
| Parameter | EPF6010ANTC100-2 | EPF6010ATC100-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | NRND |
| Family | FLEX 6000 / FLEX 6000A | FLEX 6000 |
| Logic Elements | 880 | — |
| Programmable I/O Pins | 71 | — |
| Package | 100-pin TQFP (14x14 mm, 0.5 mm pitch) | TQFP-100 (100-pin) |
| Speed Grade | -2 | -3 (commercial, slowest grade) |
| Operating Temperature | Commercial (0C to +70C) | 0C to +70C (commercial) |
| Configuration Method | SRAM (volatile), in-system programmable | — |
| Programming Interface | IEEE 1149.1 (JTAG) / passive serial / EPC configuration device | — |
| Supply Voltage (VCCINT) | 5.0 V (FLEX 6000A); 3.3 V (FLEX 6000) | 3.3 V |
| I/O Standards Supported | TTL, CMOS, PCI (with clamping diodes) | — |
| Number of LABs | [DATA_NEEDED: LAB count] | — |
| Embedded Memory | [DATA_NEEDED: embedded RAM blocks] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Packaging | Tray (per Altera packing standard) | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Logic Elements / Cells | — | 880 |
| Usable Gates | — | 10,000 |
| Logic Array Blocks (LABs) | — | 88 |
| User I/O Pins | — | 71 |
| Process Technology | — | 0.42 µm CMOS SRAM |
| I/O Voltage Tolerance | — | 3.3 V / 5 V tolerant |
| Configuration Memory | — | SRAM (external configuration device required) |
| JTAG Support | — | Yes (IEEE 1149.1) |