EPF6010ANTC100-2 vs EPF6010ATC100-3N Comparison

Detailed side-by-side comparison of EPF6010ANTC100-2 by Intel and EPF6010ATC100-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF6010ATC100-3N EPF6010ATC100-3N - FLEX 6000 FPGA, 880 Cells, 100-TQFP | Intel

EPF6010ATC100-3N - FLEX 6000 FPGA, 880 Cells, 100-TQFP | Intel

EPF6010ATC100-3N ⚠ Last Time Buy

Specification Comparison

Parameter EPF6010ANTC100-2 EPF6010ATC100-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Last Time Buy
Family FLEX 6000 / FLEX 6000A FLEX 6000
Logic Elements 880 —
Programmable I/O Pins 71 —
Package 100-pin TQFP (14x14 mm, 0.5 mm pitch) 100-pin TQFP (14 x 14 x 1.4 mm)
Speed Grade -2 -3
Operating Temperature Commercial (0C to +70C) 0 °C to +70 °C (commercial)
Configuration Method SRAM (volatile), in-system programmable —
Programming Interface IEEE 1149.1 (JTAG) / passive serial / EPC configuration device —
Supply Voltage (VCCINT) 5.0 V (FLEX 6000A); 3.3 V (FLEX 6000) —
I/O Standards Supported TTL, CMOS, PCI (with clamping diodes) —
Number of LABs [DATA_NEEDED: LAB count] —
Embedded Memory [DATA_NEEDED: embedded RAM blocks] —
Global Clock Networks [DATA_NEEDED: global clock count] —
Mounting Type Surface Mount Surface Mount
MSL Level 3 (168 hours) 3 (168 hours)
Packaging Tray (per Altera packing standard) —
RoHS Status [DATA_NEEDED: RoHS compliance] Compliant
Logic Elements / Cells — 880
Equivalent Gate Count — 10,000 gates
Logic Array Blocks (LABs) — 88
User I/Os — 71
Supply Voltage (Operating) — 3.0 V to 3.6 V
Maximum Internal Frequency — 142.86 MHz
Process Technology — 0.42 µm CMOS
Programming Method — In-system SRAM via ByteBlaster/BitBlaster

Datasheets & Resources

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