EPF6016AFC256-3 vs EPF6016AFC256-2 Comparison
Detailed side-by-side comparison of EPF6016AFC256-3 by Intel and EPF6016AFC256-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF6016AFC256-3 | EPF6016AFC256-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | Field-Programmable Gate Array (FPGA) |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | — |
| User I/Os | 171 | — |
| Maximum Internal Frequency | 142.86 MHz | 172 MHz |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.42 um CMOS SRAM |
| Core Supply Voltage | 3.3 V | — |
| Package | 256-ball FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA), 17 x 17 mm |
| Pin Count | 256 | — |
| Speed Grade | -3 | — |
| Configuration Method | SRAM (volatile, requires external PROM) | SRAM, JTAG (IEEE 1149.1) |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0C to 85C (commercial) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Typical Gates | — | 16,000 |
| Logic Elements | — | 1,320 |
| Embedded Array Blocks (EABs) | — | 4 x 2,048 bits |
| Maximum User I/Os | — | 171 |
| Supply Voltage (VCCINT) | — | 3.0 V to 3.6 V |
| RoHS Status | — | Compliant |
| Lead-Free | — | Yes |