EPF6016AFC256-3 vs EPF6016AFC256-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF6016AFC256-3 sa pamamagitan ng Intel at EPF6016AFC256-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF6016AFC256-3 | EPF6016AFC256-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | Field-Programmable Gate Array (FPGA) |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | — |
| User I/Os | 171 | — |
| Maximum Internal Frequency | 142.86 MHz | 172 MHz |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.42 um CMOS SRAM |
| Core Supply Voltage | 3.3 V | — |
| Packhaging | 256-ball FineLine BGA (FBGA) | 256-ball FBGA (FineLine BGA), 17 x 17 mm |
| Bilang ng Pin | 256 | — |
| Speed Grade | -3 | — |
| Configuration Method | SRAM (volatile, requires external PROM) | SRAM, JTAG (IEEE 1149.1) |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | 0C to 85C (commercial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Typical Gates | — | 16,000 |
| Logic Elements | — | 1,320 |
| Embedded Array Blocks (EABs) | — | 4 x 2,048 bits |
| Maximum User I/Os | — | 171 |
| Supply Voltage (VCCINT) | — | 3.0 V to 3.6 V |
| Tindminan RoHS | — | Compliant |
| Lead-Free | — | Yes |