EPF6016AFC256-3 vs EPF6016BC256-3 Comparison
Detailed side-by-side comparison of EPF6016AFC256-3 by Intel and EPF6016BC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF6016AFC256-3 | EPF6016BC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | — |
| User I/Os | 171 | — |
| Maximum Internal Frequency | 142.86 MHz | 172 MHz |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V | 5.0 V |
| Package | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA |
| Pin Count | 256 | 256 |
| Speed Grade | -3 | — |
| Configuration Method | SRAM (volatile, requires external PROM) | — |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Logic Elements (typical) | — | 1,320 cells |
| Usable Gates | — | 16,000 gates |
| User I/O Pins | — | 204 |
| I/O Standard | — | 5.0 V TTL/CMOS |
| Configuration | — | SRAM, in-system programmable |
| Boundary Scan | — | JTAG IEEE 1149.1 |
| RoHS Status | — | [DATA_NEEDED: RoHS compliance status] |