EPF6016AFC256-3 vs EPF6016BC256-3 比較
詳細並排比較 EPF6016AFC256-3 由 Intel 與 EPF6016BC256-3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPF6016AFC256-3 | EPF6016BC256-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | — |
| User I/Os | 171 | — |
| Maximum Internal Frequency | 142.86 MHz | 172 MHz |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V | 5.0 V |
| 封裝 | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA |
| 腳位數 | 256 | 256 |
| Speed Grade | -3 | — |
| Configuration Method | SRAM (volatile, requires external PROM) | — |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| 工作溫度 | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Logic Elements (typical) | — | 1,320 cells |
| Usable Gates | — | 16,000 gates |
| User I/O Pins | — | 204 |
| I/O Standard | — | 5.0 V TTL/CMOS |
| Configuration | — | SRAM, in-system programmable |
| Boundary Scan | — | JTAG IEEE 1149.1 |
| RoHS 狀態 | — | [DATA_NEEDED: RoHS compliance status] |