EPF6016BC256-3 vs EPF6016BC256-3N Comparison

Detailed side-by-side comparison of EPF6016BC256-3 by Intel and EPF6016BC256-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6016BC256-3 EPF6016BC256-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 6000 FLEX 6000
Logic Elements (typical) 1,320 cells —
Usable Gates 16,000 gates —
User I/O Pins 204 —
Maximum Internal Frequency 172 MHz —
Process Technology 0.42 µm CMOS SRAM 0.42 µm CMOS
Core Supply Voltage 5.0 V —
I/O Standard 5.0 V TTL/CMOS —
Package 256-ball FineLine BGA 256-BGA (FineLine)
Pin Count 256 —
Operating Temperature 0 °C to +85 °C (commercial) —
Configuration SRAM, in-system programmable —
Boundary Scan JTAG IEEE 1149.1 —
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Device Type — Field Programmable Gate Array (FPGA)
Logic Elements (LEs) — 1320
Typical Gate Count — 16,000 gates
User I/Os — 204
Internal Frequency (max) — 125 MHz
Supply Voltage — 5 V
Speed Grade — -3
Temperature Range — 0 °C to +85 °C (industrial, N suffix)
Configuration Method — Serial configuration EPROM
Packaging — Tray

Datasheets & Resources

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