EPF6024ABC256-2N vs EPF6016BC256-3 Comparison

Detailed side-by-side comparison of EPF6024ABC256-2N by Intel and EPF6016BC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6024ABC256-2N EPF6016BC256-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $22.10 $17.10
Family FLEX 6000 FLEX 6000
Logic Elements / Cells 1,960 —
Gate Count 24,000 gates —
Logic Array Blocks (LABs) 196 —
User I/O Pins 218 204
Package 256-ball BGA (BC256) 256-ball FineLine BGA
Supply Voltage 3.3 V —
Process Technology 0.42 µm CMOS 0.42 µm CMOS SRAM
Internal Frequency (max) 172 MHz —
Operating Temperature 0 °C to 85 °C (commercial) 0 °C to +85 °C (commercial)
Mounting Type Surface Mount Surface Mount
JTAG / Boundary Scan Yes (JTAG BST) —
I/O Features Slew-rate control, tri-state buffers —
Setup Time 2 ns (typical via FastTrack) —
Hold Time 0 ns —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Lead-Free [DATA_NEEDED: lead-free status] —
Logic Elements (typical) — 1,320 cells
Usable Gates — 16,000 gates
Maximum Internal Frequency — 172 MHz
Core Supply Voltage — 5.0 V
I/O Standard — 5.0 V TTL/CMOS
Pin Count — 256
Configuration — SRAM, in-system programmable
Boundary Scan — JTAG IEEE 1149.1

Datasheets & Resources

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