EPF6024AFC256-1 vs EPF6024AFC256-3 Comparison

Detailed side-by-side comparison of EPF6024AFC256-1 by Intel and EPF6024AFC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6024AFC256-1 EPF6024AFC256-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 6000 FLEX 6000
Device Logic Elements / Cells 1960 —
Equivalent Gate Count 24,000 gates —
Logic Array Blocks (LABs) 196 —
Number of I/O 219 (218 user I/O pins) —
Maximum Internal Frequency 200 MHz 172 MHz
Internal Frequency 172 MHz —
Process Technology 0.42 µm CMOS, SRAM-based 0.42 umm CMOS
Supply Voltage (Core) 3.3 V —
Package Type 256-pin FBGA (FineLine BGA) —
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C to +85°C (commercial) 0C to +85C (commercial)
Configuration Method SRAM, serial configuration device required SRAM, serial/parallel via MAX+PLUS II or Quartus
RoHS Status [DATA_NEEDED: rohs status] unknown
Lead-Free [DATA_NEEDED: lead-free status] unknown
Logic Elements / Cells — 1960
Total Gates — 24K
Maximum Operating Frequency — 142.86 MHz
User I/Os — 218
Supply Voltage — 3.3 V
Package — 256-ball FBGA (FineLine BGA)
Pins / Balls — 256
Device Type — FPGA (Field Programmable Gate Array) / SPLD classification in some catalogs
Speed Grade — -3 (fastest of three FLEX 6000 commercial grades)
Supplier Package Code — BGA-256 / FBGA-256

Datasheets & Resources

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