EPF6024AFC256-1 vs EPF6024AFC256-3 Vergleich
Detaillierter Direktvergleich von EPF6024AFC256-1 von Intel und EPF6024AFC256-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF6024AFC256-3 - 24K Gates 1960 Cells FLEX 6000 FPGA | Intel | BGA-256
EPF6024AFC256-3 ObsoleteSpezifikationsvergleich
| Parameter | EPF6024AFC256-1 | EPF6024AFC256-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,95 | $15,60 |
| Family | FLEX 6000 | FLEX 6000 |
| Device Logic Elements / Cells | 1960 | — |
| Equivalent Gate Count | 24,000 gates | — |
| Logic Array Blocks (LABs) | 196 | — |
| Number of I/O | 219 (218 user I/O pins) | — |
| Maximum Internal Frequency | 200 MHz | 172 MHz |
| Internal Frequency | 172 MHz | — |
| Process Technology | 0.42 µm CMOS, SRAM-based | 0.42 umm CMOS |
| Supply Voltage (Core) | 3.3 V | — |
| Package Type | 256-pin FBGA (FineLine BGA) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0°C to +85°C (commercial) | 0C to +85C (commercial) |
| Configuration Method | SRAM, serial configuration device required | SRAM, serial/parallel via MAX+PLUS II or Quartus |
| RoHS-Status | [DATA_NEEDED: rohs status] | unknown |
| Lead-Free | [DATA_NEEDED: lead-free status] | unknown |
| Logic Elements / Cells | — | 1960 |
| Total Gates | — | 24K |
| Maximum Operating Frequency | — | 142.86 MHz |
| User I/Os | — | 218 |
| Versorgungsspannung | — | 3.3 V |
| Gehäuse | — | 256-ball FBGA (FineLine BGA) |
| Pins / Balls | — | 256 |
| Device Type | — | FPGA (Field Programmable Gate Array) / SPLD classification in some catalogs |
| Speed Grade | — | -3 (fastest of three FLEX 6000 commercial grades) |
| Supplier Package Code | — | BGA-256 / FBGA-256 |