EPF81500ARC240-3 vs EPF8820AGC192-2 Comparison
Detailed side-by-side comparison of EPF81500ARC240-3 by Intel and EPF8820AGC192-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF81500ARC240-3 | EPF8820AGC192-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 8000 | FLEX 8000 |
| Logic Elements / Cells | 1296 | — |
| Usable Gates | 16,000 | 8,000 (up to 16,000) |
| Registers (Flip-Flops) | 1500 | — |
| User I/O Pins | 181 | — |
| Number of Logic Array Blocks (LABs) | 162 | — |
| Number of Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | [DATA_NEEDED: total embedded RAM bits] | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS |
| Core Supply Voltage (VCCINT) | 5 V | — |
| I/O Supply Voltage (VCCIO) | 3.3 V / 5 V | — |
| Maximum Internal Frequency | 125 MHz (speed grade -3) | 125 MHz |
| Package | 240-BFQFP Exposed Pad (240-RQFP) | 192-pin CPGA (Ceramic Pin Grid Array) |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: commercial/industrial/military grade] |
| Configuration Method | SRAM, serial or parallel EPROM, JTAG | SRAM, In-Circuit Reconfigurable (ICR) |
| Mounting Type | Surface Mount | Through-Hole (CPGA socket required) |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Non-compliant (CPGA, legacy) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Cells | — | 672 |
| Registers | — | 1,500 |
| Propagation Delay | — | 5.0 ns |
| Supply Voltage (VCCINT) | — | 5 V |
| I/O Tolerance | — | 3.3 V / 5 V |
| Pin Count | — | 192 |