EPF81500ARC240-3 - FLEX 8000 FPGA 16K Gates 240-RQFP | Intel
MPN: EPF81500ARC240-3 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $38.5 | $385.00 |
| 100 | $32 | $3,200.00 |
| 500 | $28.5 | $14,250.00 |
| 1,000 | $25 | $25,000.00 |
Drop-in alternatives for EPF81500ARC240-3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPF81500ARC240-2
β Drop-Inβ In Stock
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View Datasheet βEPF81500AQC240-3
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View Datasheet βEPF81500AQC240-4
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$18.25 / Unit
View Datasheet βEPF81500AQC240-2
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$61.4 / Unit
View Datasheet βEPF81500AQC240-2N
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$18.95 / Unit
View Datasheet βEPF81500ARC240-2A
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$44.2 / Unit
View Datasheet βEPF81500ARC240-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements / Cells | 1296 |
| Usable Gates | 16,000 |
| Registers (Flip-Flops) | 1500 |
| User I/O Pins | 181 |
| Number of Logic Array Blocks (LABs) | 162 |
| Number of Embedded Array Blocks (EABs) | 12 |
| Process Technology | 0.42 Β΅m CMOS |
| Core Supply Voltage (VCCINT) | 5 V |
| I/O Supply Voltage (VCCIO) | 3.3 V / 5 V |
| Maximum Internal Frequency | 125 MHz (speed grade -3) |
| Package | 240-BFQFP Exposed Pad (240-RQFP) |
| Configuration Method | SRAM, serial or parallel EPROM, JTAG |
| Mounting Type | Surface Mount |
EPF81500ARC240-3 Pin Configuration
| Pin 1 | I/O β User I/O pin |
| Pin 2 | I/O β User I/O pin |
| Pin 3 | I/O β User I/O pin |
| Pin 4 | I/O β User I/O pin |
| Pin 5 | VCCINT β Core supply voltage (5V) |
| Pin 6 | GND β Ground |
| Pin 7 | I/O β User I/O pin |
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| Pin 182 | GND β Ground |
| Pin 183 | VCCIO β I/O supply voltage (3.3V or 5V) |
| Pin 184 | MSEL0 β Configuration mode select 0 |
| Pin 185 | MSEL1 β Configuration mode select 1 |
| Pin 186 | MSEL2 β Configuration mode select 2 |
| Pin 187 | nSTATUS β Configuration status (open drain) |
| Pin 188 | nCONFIG β Configuration control (active low) |
| Pin 189 | DCLK β Configuration clock input |
| Pin 190 | DATA0 β Configuration data input |
| Pin 191 | CONF_DONE β Configuration complete (open drain) |
| Pin 192 | nCE β Chip enable (active low) |
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Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF81500ARC240-3 is suitable for 6 applications: Industrial Automation Controllers, Telecommunications Line Cards, Legacy 5V System Glue Logic, ASIC Prototyping Platform, Military and Aerospace Avionics (Legacy), Medical Imaging Front-End.
Industrial Automation Controllers
The EPF81500ARC240-3 fits industrial automation controllers because its 16,000 usable gates and 181 user I/O provide ample logic for state-machine-based machine control, encoder interfacing, and multi-axis motion sequencing. The FLEX 8000 architecture's embedded array blocks (EABs) implement FIFO buffers and look-up-table-based waveform generators used in PID loops, while the 5V core with 3.3V/5V multi-volt I/O enables direct interface to legacy 5V PLC peripherals and modern 3.3V sensors without level shifters. In-circuit reconfigurability (ICR) permits field firmware updates over JTAG or EPC serial devices, which is essential for deployed machinery that cannot be easily returned for service.
Recommended
Telecommunications Line Cards
Telecommunications line cards benefit from the EPF81500ARC240-3's 181 user I/O and 1,296 logic cells, which provide enough capacity for T1/E1 framers, HDLC controllers, and time-slot interchangers common in legacy telecom equipment. The 240-RQFP package exposes the full FastTrack interconnect routing, ensuring predictable timing for synchronous serial interfaces. SRAM-based configuration allows remote firmware updates via JTAG or processor-driven serial configuration, important for central-office equipment that must support feature upgrades without physical access. The device's 5V-tolerant I/O bridges 3.3V backplane logic to legacy 5V line-interface units (LIUs) without external buffers.
Recommended
Legacy 5V System Glue Logic
The EPF81500ARC240-3 is well-suited as a glue-logic consolidator in 5V systems where multiple discrete 74-series TTL/CMOS parts would otherwise be needed for address decoding, bus arbitration, or custom state machines. Its 5V VCCINT and 3.3V/5V VCCIO interface directly to both legacy 5V microprocessors (e.g. 8051, 68k) and modern 3.3V peripherals. With 1,500 registers and 162 LABs, designers can replace 20-30 discrete MSI/SSI packages with a single 240-RQFP FPGA, reducing board area, improving reliability, and simplifying ECO changes during product evolution.
Recommended
ASIC Prototyping Platform
Designers prototyping ASIC designs use the EPF81500ARC240-3 to validate RTL before committing to mask fabrication. The FLEX 8000 family provides 16K usable gates and in-circuit reconfigurability, allowing fast design iterations via JTAG or EPC configuration devices. SRAM configuration eliminates the need for UV-erase cycles required by older CPLDs, dramatically shortening debug cycles. The 240-RQFP package with exposed pad supports real-world clock rates (~125 MHz) representative of ASIC target performance, and the 5V/3.3V multi-volt I/O replicates the I/O environment of many ASIC processes used in the late 1990s.
Recommended
Military and Aerospace Avionics (Legacy)
Legacy avionics platforms use the EPF81500ARC240-3 in display drivers, sensor interfaces, and bus controllers where its wide operating voltage tolerance and exposed-pad thermal dissipation are valued. The 240-RQFP package is mechanically robust and qualified for many legacy MIL-spec environments. Designers must consult the original Flex 8000 datasheet for full military temperature grade information. For new aerospace designs, however, modern radiation-hardened FPGAs (e.g. Microsemi RTG4, Xilinx Virtex-5QV) should be evaluated instead, as FLEX 8000 is not radiation-hardened by design.
Recommended
Medical Imaging Front-End
Legacy medical imaging front-ends (ultrasound beamformers, MRI receiver arrays) use the EPF81500ARC240-3 to implement channel-selection logic, gain control, and ADC-interface glue. The 181 user I/O accommodates parallel ADC data buses (10-16 bits per channel x multiple channels), while the 1,296 logic cells perform pipelined multiplexing and digital filtering. The 5V I/O tolerance interfaces directly to legacy medical-grade analog front-ends. Designers must verify biocompatibility, sterilization, and regulatory compliance separately; this FPGA is a logic component within a larger medical system subject to FDA/CE approvals.
Recommended
Recommended Products Summary
Engineering reference data for EPF81500ARC240-3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF81500ARC240-2 | EPF81500AQC240-3 | EPF81500AQC240-4 | EPF81500AQC240-2 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 240-BFQFP Exposed Pad (240-RQFP) | 240-BFQFP Exposed Pad (240-RQFP) | 240-BFQFP Exposed Pad (240-RQFP) | 240-BFQFP Exposed Pad (240-RQFP) | 240-BFQFP Exposed Pad (240-RQFP) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Usable Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Cells | 1296 | 1296 | 1296 | 1296 | 1296 |
| User I/O | 181 | 181 | 181 | 181 | 181 |
| Speed Grade | -3 (125 MHz) | -2 (~100 MHz) | -3 (125 MHz) | -4 (~150 MHz) | -2 (~100 MHz) |
| Temperature Grade | Industrial (A suffix) | Industrial | Commercial | Commercial | Commercial |
| Process / VCCINT | 0.42 Β΅m CMOS / 5V | 0.42 Β΅m CMOS / 5V | 0.42 Β΅m CMOS / 5V | 0.42 Β΅m CMOS / 5V | 0.42 Β΅m CMOS / 5V |
Key Differentiators
- Same silicon with different speed grade within FLEX 8000 family (vs EPF81500ARC240-2)
- Industrial temperature grade option (vs EPF81500AQC240-3)
- Higher performance option in same package (vs EPF81500AQC240-4)
Design Notes
The EPF81500ARC240-3 requires a stable 5V VCCINT supply and a separate VCCIO rail (3.3V or 5V). Place 0.1 Β΅F decoupling capacitors as close as possible to every VCCINT/VCCIO pin pair, plus bulk 10-47 Β΅F tantalum or ceramic capacitors near the package. According to FLEX 8000 datasheet guidelines, supply voltage must ramp monotonically from 0V to nominal during power-up to avoid latch-up or partial configuration. Use a supervisor IC (e.g. TL7705 or equivalent) to monitor VCCINT and hold nCONFIG low until all rails are stable.
The 240-RQFP Exposed Pad package requires a PCB thermal land pattern with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting the exposed pad to an internal copper plane. Estimated: with all 181 I/O toggling at 125 MHz, core dissipation is approximately 0.5-1.5 W; without the exposed pad soldered, junction temperature may exceed 100 Β°C in still air. Recommended copper area is at least 1 square inch on top plus 4 square inches on internal ground plane.
Route all configuration signals (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE, MSEL[0:2]) as short and direct as possible. Keep DCLK traces length-matched if multiple FPGAs share a configuration chain. The 240-RQFP at 0.5 mm pitch requires precise PCB fabrication (laser-drilled or fine-pitch capable processes). Use a 4-layer PCB with continuous ground plane beneath the FPGA for signal integrity and EMI suppression.
Do not leave MSEL[0:2] floating - they must be tied to VCCINT or GND to select the correct configuration mode (e.g. 000 = PS mode with EPC1, 010 = AS mode). nSTATUS and CONF_DONE are open-drain outputs and require external pull-up resistors (typically 10 kΞ© to VCCINT). Do not confuse EPF81500 (16K gates, 1296 cells, 181 I/O) with EPF81188 or EPF6010/6016/6024 - these are different FLEX 8000 family members with different logic capacities.
Compliance Information
FLEX 8000 family predates widespread RoHS adoption; specific compliance status for EPF81500ARC240-3 should be verified per lot via manufacturer declaration letter. AEC-Q100 not applicable (FPGA, not automotive-grade qualified).
