EPF8282ATC100-2 vs EPF8282ATC100-3 Comparison

Detailed side-by-side comparison of EPF8282ATC100-2 by Intel and EPF8282ATC100-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF8282ATC100-2 EPF8282ATC100-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Family FLEX 8000 FLEX 8000
Usable Gates 2,500 2,500
Logic Cells 208 —
Logic Array Blocks (LABs) 26 —
User I/Os 78 —
Flip-Flops 282 —
Supply Voltage 5 V —
Process Technology 0.42 µm CMOS 0.42 micron CMOS SRAM
Package 100-pin TQFP 100-pin TQFP (100-TQFP)
Operating Temperature 0 °C to 70 °C (Commercial) —
Speed Grade -2 -3
Mounting Type Surface Mount —
Configuration Memory SRAM (volatile, requires external boot) —
Development Tool Altera MAX+PLUS II —
RoHS Status [DATA_NEEDED: RoHS status] —
Logic Cells (LEs) — 208
Typical Gates Equivalent — 12,000
Maximum User I/O — 78
Number of Logic Array Blocks (LABs) — 26
Embedded Array Blocks (EABs) — 6
Total RAM Bits — 12 Kbits
Supply Voltage (Core) — 5 V
MultiVolt I/O Support — 3.3 V / 5 V
Maximum Frequency — 125 MHz
Configuration Method — SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor
Operating Temperature (Commercial) — 0 C to +70 C
In-Circuit Reconfigurable — Yes (ICR)
Boundary Scan — JTAG IEEE 1149.1

Datasheets & Resources

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