EPF8282ATC100-3 - FLEX 8000 FPGA 2.5K Gates 78 I/O TQFP-100 | Intel
MPN: EPF8282ATC100-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.6 | $5,800.00 |
| 1,000 | $10.25 | $10,250.00 |
Drop-in alternatives for EPF8282ATC100-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPF8282ATC100-2
✅ Drop-In✓ In Stock
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View Datasheet →EPF8282ATC100-3N
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EPF8282ATC100-2W
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EPF8282ATC100-4
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View Datasheet →EPF8282ATI100-3
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$15.6 / Unit
View Datasheet →EPF8282ATC100-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Cells (LEs) | 208 |
| Usable Gates | 2,500 |
| Typical Gates Equivalent | 12,000 |
| Maximum User I/O | 78 |
| Number of Logic Array Blocks (LABs) | 26 |
| Embedded Array Blocks (EABs) | 6 |
| Total RAM Bits | 12 Kbits |
| Process Technology | 0.42 micron CMOS SRAM |
| Supply Voltage (Core) | 5 V |
| MultiVolt I/O Support | 3.3 V / 5 V |
| Maximum Frequency | 125 MHz |
| Speed Grade | -3 |
| Package | 100-pin TQFP (100-TQFP) |
| Configuration Method | SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor |
| Operating Temperature (Commercial) | 0 C to +70 C |
| In-Circuit Reconfigurable | Yes (ICR) |
| Boundary Scan | JTAG IEEE 1149.1 |
EPF8282ATC100-3 100-pin tqfp (100-tqfp) Pin Configuration Guide
Complete pinout information for EPF8282ATC100-3 (100-pin tqfp (100-tqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8282ATC100-3.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8282ATC100-3 is suitable for 6 applications: Telecommunications Switching and Routing, Industrial Control and Automation, Test and Measurement Instrumentation, Legacy Embedded System Retrofit, Peripheral Bus Interfacing and Bridging, Glue Logic for Microprocessor Systems.
Telecommunications Switching and Routing
The EPF8282ATC100-3 fits telecommunications switching equipment because its 78 I/O count and 125 MHz operation handle 32-bit bus aggregation, packet header parsing, and glue logic between network processors and PHYs. The 5V core and MultiVolt I/O simplify interfacing to legacy TDM backplanes, while the 2,500 usable gates are sufficient for state machines, FIFO controllers, and serial-to-parallel converters. Compared with discrete 74-series logic, integrating these functions into one FPGA reduces board area by 50-70% and improves timing margin through deterministic fast-track interconnect delays.
Recommended
Industrial Control and Automation
In industrial control PLCs and motor drives, the EPF8282ATC100-3 serves as glue logic between microcontrollers, sensor interfaces, and power-stage gate drivers. Its 78 I/O support multiple encoder inputs, PWM channels, and discrete I/O banks without external bus expanders. The device's deterministic interconnect delays simplify timing closure for safety-critical signal paths. Engineers use the 12 Kbits of embedded RAM for encoder tables, PID coefficient storage, and communication protocol buffers, eliminating external SRAM in cost-sensitive designs.
Recommended
Test and Measurement Instrumentation
The EPF8282ATC100-3 is well suited for test instruments such as logic analyzers, protocol analyzers, and stimulus generators. Its 125 MHz operation captures 32-bit parallel bus traffic at full speed, while 208 logic elements implement address decoding, trigger logic, and pattern generation. The JTAG boundary-scan support simplifies board-level test and in-system programming, allowing factory test engineers to verify interconnect without bed-of-nails fixtures.
Recommended
Legacy Embedded System Retrofit
The EPF8282ATC100-3 is frequently deployed to retrofit legacy embedded systems where the original discrete-logic or PAL-based glue logic has reached end-of-life. Its 100-pin TQFP footprint fits the same PCB land pattern as older 84-pin PLCC packages when a small adapter board is used. Engineers replace 5-15 discrete 74-series ICs with a single FLEX 8000 device, reducing power consumption by 30-50% and improving signal integrity through controlled-impedance interconnect.
Recommended
Peripheral Bus Interfacing and Bridging
The EPF8282ATC100-3 bridges between incompatible peripheral buses such as ISA, PC/104, VME, and custom backplanes. Its 78 I/O can drive a 32-bit data bus plus full address and control signals without external buffers, and the 5V tolerance matches legacy bus levels. The MultiVolt I/O supports 3.3V peripherals when interfacing modern ASICs. Bus-bridge designs use the embedded RAM for FIFO buffering and the logic elements for protocol state machines, achieving lower latency than software-based bridging.
Recommended
Glue Logic for Microprocessor Systems
The EPF8282ATC100-3 replaces 5-20 discrete glue-logic ICs around 80x86, 68k, MIPS, and PowerPC microprocessors, integrating address decoding, wait-state generation, bus arbitration, chip-select logic, and interrupt prioritization. Designers reclaim significant board area and improve timing margin by replacing asynchronous discrete logic with deterministic FLEX 8000 interconnect. The JTAG support enables boundary-scan test of the entire glue-logic layer, simplifying manufacturing test.
Recommended
Recommended Products Summary
Engineering reference data for EPF8282ATC100-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8282ATC100-2 | EPF8282ATC100-3N | EPF8282ATC100-2W | EPF8282ATC100-4 | EPF8282ATI100-3 |
|---|---|---|---|---|---|---|
| Package | 100-pin TQFP | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Usable Gates | 2,500 | 2,500 | 2,500 | 2,500 | 2,500 | 2,500 |
| Logic Elements | 208 | 208 | 208 | 208 | 208 | 208 |
| User I/O | 78 | 78 | 78 | 78 | 78 | 78 |
| Speed Grade | -3 | -2 (slower) | -3 (same) | -2 (slower, extended temp) | -4 (slowest) | -3 (industrial temp) |
| Maximum Frequency | 125 MHz | ~90 MHz | 125 MHz | ~90 MHz | ~75 MHz | 125 MHz |
| Supply Voltage | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to +70 C | 0 C to +70 C | -40 C to +85 C (Extended) | 0 C to +70 C | -40 C to +85 C (Industrial) |
| Lead-Free / Pb-Free | No (SnPb finish standard) | No | Yes (Pb-free) | No | No | No |
Key Differentiators
- Highest speed grade in the FLEX 8000 TQFP-100 family (vs EPF8282ATC100-2)
- Lead-free variant available for RoHS-compliant designs (vs EPF8282ATC100-3N)
- Industrial temperature grade available in same package (vs EPF8282ATI100-3)
- On-chip RAM and EABs eliminate external memory (vs Discrete 74-series glue logic)
Design Notes
The EPF8282ATC100-3 requires a stable 5 V +/- 5% supply for the core and dedicated VCC pins for the I/O banks. Place 0.1 uF ceramic decoupling capacitors within 0.5 cm of every VCC pin and bulk 10-47 uF tantalum capacitors at the board entry point. In-circuit reconfiguration draws transient currents of up to 200 mA during configuration; ensure the regulator can source this without droop.
Use a 4-layer PCB with continuous ground plane beneath the TQFP-100 package to control impedance and reduce SSO (simultaneous switching output) noise. Route all 78 user I/O traces with matched impedance (typically 50 ohms single-ended) and keep clock traces shorter than 25 mm to avoid reflections. The TQFP-100 has a 0.5 mm pitch requiring fine-pitch assembly; follow IPC-7351 land pattern guidelines.
Configure all unused I/O pins as outputs driving ground to minimize power consumption and SSO noise. Do not leave user I/O floating during configuration - this can cause unpredictable behavior. Ensure the configuration device (EPC1, EPC1064, or EPC1441) is sized correctly for the design bitstream; undersized configuration memory causes configuration failures. Verify the nCONFIG, nSTATUS, and CONF_DONE pull-up/pull-down resistor values match the datasheet reference design.
The 78 user I/O can drive up to 24 mA per pin, but simultaneous switching of many outputs (SSO) creates ground bounce. Limit SSO to 8-10 outputs per I/O bank and use staggered output enable timing in high-speed designs. Place series damping resistors (22-33 ohms) on clock outputs driving long traces to reduce ringing.
Compliance Information
Standard EPF8282ATC100-3 is SnPb finish (non-RoHS); EPF8282ATC100-3N variant is Pb-free for RoHS-compliant designs. Not AEC-Q100 qualified - not recommended for new automotive applications.
