EPF8452AQC160-3AC vs EPF8452AQC160-2 Comparison
Detailed side-by-side comparison of EPF8452AQC160-3AC by Intel and EPF8452AQC160-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF8452AQC160-3AC | EPF8452AQC160-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 8000 | FLEX 8000 |
| Logic Elements | 336 | — |
| Usable Gates | 4,000 | ~4,000 |
| Maximum User I/O | 120 | — |
| Number of I/O Banks | 8 | — |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM |
| Supply Voltage (Core) | 5 V | — |
| I/O Voltage Tolerance | 3.3 V and 5 V | — |
| Speed Grade | -3 | -2 (lowest-cost tier) |
| Operating Temperature | -40 °C to +85 °C (Industrial) | 0 °C to 70 °C (commercial) |
| Package | 160-pin PQFP (QFP) | 160-pin PQFP (160-BQFP), gull-wing |
| Mounting Type | Surface Mount | — |
| Configuration Interface | JTAG / Serial (ISP) | — |
| RoHS Status | Non-compliant (legacy PQFP) | [DATA_NEEDED: RoHS status] |
| Lead-Free | No (Sn/Pb lead finish) | — |
| MSL Level | 3 (168 hours) | — |
| Configuration Memory | SRAM (volatile, re-load required at power-up) | — |
| Embedded Array Blocks (EABs) | Yes (RAM/ROM) | — |
| Logic Elements / Cells | — | 336 |
| Logic Array Blocks (LABs) | — | 42 |
| Number of I/Os (this package) | — | 120 (per Altera data), 68 (per DigiKey listing) |
| Number of Registers | — | ~1,500 |
| Supply Voltage | — | 5 V (4.75 V to 5.25 V) |
| Configuration Method | — | SRAM, in-circuit reconfigurable |
| Configuration Devices Supported | — | EPC1, EPC1064, EPC1213, EPC1441 |
| Terminal Form | — | GULL WING |
| Terminal Pitch | — | [DATA_NEEDED: pin pitch] |