EPF8452AQC160-3AC vs EPF8452AQC160-2 Vergleich
Detaillierter Direktvergleich von EPF8452AQC160-3AC von Intel und EPF8452AQC160-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF8452AQC160-3AC | EPF8452AQC160-2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $14,10 | $23,85 |
| Family | FLEX 8000 | FLEX 8000 |
| Logic Elements | 336 | — |
| Usable Gates | 4,000 | ~4,000 |
| Maximum User I/O | 120 | — |
| Number of I/O Banks | 8 | — |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM |
| Supply Voltage (Core) | 5 V | — |
| I/O Voltage Tolerance | 3.3 V and 5 V | — |
| Speed Grade | -3 | -2 (lowest-cost tier) |
| Betriebstemperatur | -40 °C to +85 °C (Industrial) | 0 °C to 70 °C (commercial) |
| Gehäuse | 160-pin PQFP (QFP) | 160-pin PQFP (160-BQFP), gull-wing |
| Montageart | Surface Mount | — |
| Configuration Interface | JTAG / Serial (ISP) | — |
| RoHS-Status | Non-compliant (legacy PQFP) | [DATA_NEEDED: RoHS status] |
| Lead-Free | No (Sn/Pb lead finish) | — |
| MSL-Level | 3 (168 hours) | — |
| Configuration Memory | SRAM (volatile, re-load required at power-up) | — |
| Embedded Array Blocks (EABs) | Yes (RAM/ROM) | — |
| Logic Elements / Cells | — | 336 |
| Logic Array Blocks (LABs) | — | 42 |
| Number of I/Os (this package) | — | 120 (per Altera data), 68 (per DigiKey listing) |
| Number of Registers | — | ~1,500 |
| Versorgungsspannung | — | 5 V (4.75 V to 5.25 V) |
| Configuration Method | — | SRAM, in-circuit reconfigurable |
| Configuration Devices Supported | — | EPC1, EPC1064, EPC1213, EPC1441 |
| Terminal Form | — | GULL WING |
| Terminal Pitch | — | [DATA_NEEDED: pin pitch] |