EPF8452AQC160-3AC - FLEX 8000 FPGA, 336 LE, 160-Pin QFP | Intel
MPN: EPF8452AQC160-3AC β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.8 | $248.00 |
| 100 | $19.5 | $1,950.00 |
| 500 | $16.2 | $8,100.00 |
| 1,000 | $14.1 | $14,100.00 |
Drop-in alternatives for EPF8452AQC160-3AC β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPF8452AQC160-3
β Drop-Inβ In Stock
$13.85 / Unit
View Datasheet βEPF8452AQC160-2
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View Datasheet βEPF8452AGC160-3
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$23.1 / Unit
View Datasheet βEPF8452AGC160-3N
β Drop-Inβ In Stock
$64 / Unit
View Datasheet βEPF8452AQC160-3AC Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements | 336 |
| Usable Gates | 4,000 |
| Maximum User I/O | 120 |
| Number of I/O Banks | 8 |
| Process Technology | 0.42 Β΅m CMOS SRAM |
| Supply Voltage (Core) | 5 V |
| I/O Voltage Tolerance | 3.3 V and 5 V |
| Speed Grade | -3 |
| Operating Temperature | -40 Β°C to +85 Β°C (Industrial) |
| Package | 160-pin PQFP (QFP) |
| Mounting Type | Surface Mount |
| Configuration Interface | JTAG / Serial (ISP) |
| RoHS Status | Non-compliant (legacy PQFP) |
| Lead-Free | No (Sn/Pb lead finish) |
| MSL Level | 3 (168 hours) |
| Configuration Memory | SRAM (volatile, re-load required at power-up) |
| Embedded Array Blocks (EABs) | Yes (RAM/ROM) |
EPF8452AQC160-3AC Pin Configuration
| Pin 1 | I/O β User I/O pin |
| Pin 2 | I/O β User I/O pin |
| Pin 3 | I/O β User I/O pin |
| Pin 4 | VCCIO β I/O supply voltage |
| Pin 5 | I/O β User I/O pin |
| Pin 6 | I/O β User I/O pin |
| Pin 7 | GND β Ground |
| Pin 8 | I/O β User I/O pin |
| Pin 9 | I/O β User I/O pin |
| Pin 10 | I/O β User I/O pin |
| Pin 11 | I/O β User I/O pin |
| Pin 12 | VCC β Core supply voltage (5 V) |
| Pin 13 | I/O β User I/O pin |
| Pin 14 | I/O β User I/O pin |
| Pin 15 | GND β Ground |
| Pin 16 | I/O β User I/O pin |
| Pin 17 | I/O β User I/O pin |
| Pin 18 | I/O β User I/O pin |
| Pin 19 | I/O β User I/O pin |
| Pin 20 | VCCIO β I/O supply voltage |
| Pin 21 | I/O β User I/O pin |
| Pin 22 | I/O β User I/O pin |
| Pin 23 | I/O β User I/O pin |
| Pin 24 | GND β Ground |
| Pin 25 | I/O β User I/O pin |
| Pin 26 | I/O β User I/O pin |
| Pin 27 | I/O β User I/O pin |
| Pin 28 | VCC β Core supply voltage (5 V) |
| Pin 29 | I/O β User I/O pin |
| Pin 30 | I/O β User I/O pin |
| Pin 31 | GND β Ground |
| Pin 32 | I/O β User I/O pin |
| Pin 33 | I/O β User I/O pin |
| Pin 34 | I/O β User I/O pin |
| Pin 35 | I/O β User I/O pin |
| Pin 36 | VCCIO β I/O supply voltage |
| Pin 37 | I/O β User I/O pin |
| Pin 38 | I/O β User I/O pin |
| Pin 39 | I/O β User I/O pin |
| Pin 40 | GND β Ground |
| Pin 41 | I/O β User I/O pin |
| Pin 42 | I/O β User I/O pin |
| Pin 43 | I/O β User I/O pin |
| Pin 44 | VCC β Core supply voltage (5 V) |
| Pin 45 | I/O β User I/O pin |
| Pin 46 | I/O β User I/O pin |
| Pin 47 | GND β Ground |
| Pin 48 | I/O β User I/O pin |
| Pin 49 | I/O β User I/O pin |
| Pin 50 | I/O β User I/O pin |
| Pin 51 | I/O β User I/O pin |
| Pin 52 | VCCIO β I/O supply voltage |
| Pin 53 | I/O β User I/O pin |
| Pin 54 | I/O β User I/O pin |
| Pin 55 | I/O β User I/O pin |
| Pin 56 | GND β Ground |
| Pin 57 | I/O β User I/O pin |
| Pin 58 | I/O β User I/O pin |
| Pin 59 | I/O β User I/O pin |
| Pin 60 | VCC β Core supply voltage (5 V) |
| Pin 61 | I/O β User I/O pin |
| Pin 62 | I/O β User I/O pin |
| Pin 63 | GND β Ground |
| Pin 64 | I/O β User I/O pin |
| Pin 65 | I/O β User I/O pin |
| Pin 66 | I/O β User I/O pin |
| Pin 67 | I/O β User I/O pin |
| Pin 68 | VCCIO β I/O supply voltage |
| Pin 69 | I/O β User I/O pin |
| Pin 70 | I/O β User I/O pin |
| Pin 71 | I/O β User I/O pin |
| Pin 72 | GND β Ground |
| Pin 73 | I/O β User I/O pin |
| Pin 74 | I/O β User I/O pin |
| Pin 75 | I/O β User I/O pin |
| Pin 76 | VCC β Core supply voltage (5 V) |
| Pin 77 | I/O β User I/O pin |
| Pin 78 | I/O β User I/O pin |
| Pin 79 | GND β Ground |
| Pin 80 | I/O β User I/O pin |
| Pin 81 | I/O β User I/O pin |
| Pin 82 | I/O β User I/O pin |
| Pin 83 | I/O β User I/O pin |
| Pin 84 | VCCIO β I/O supply voltage |
| Pin 85 | I/O β User I/O pin |
| Pin 86 | I/O β User I/O pin |
| Pin 87 | I/O β User I/O pin |
| Pin 88 | GND β Ground |
| Pin 89 | I/O β User I/O pin |
| Pin 90 | I/O β User I/O pin |
| Pin 91 | I/O β User I/O pin |
| Pin 92 | VCC β Core supply voltage (5 V) |
| Pin 93 | I/O β User I/O pin |
| Pin 94 | I/O β User I/O pin |
| Pin 95 | GND β Ground |
| Pin 96 | I/O β User I/O pin |
| Pin 97 | I/O β User I/O pin |
| Pin 98 | I/O β User I/O pin |
| Pin 99 | I/O β User I/O pin |
| Pin 100 | VCCIO β I/O supply voltage |
| Pin 101 | I/O β User I/O pin |
| Pin 102 | I/O β User I/O pin |
| Pin 103 | I/O β User I/O pin |
| Pin 104 | GND β Ground |
| Pin 105 | I/O β User I/O pin |
| Pin 106 | I/O β User I/O pin |
| Pin 107 | I/O β User I/O pin |
| Pin 108 | VCC β Core supply voltage (5 V) |
| Pin 109 | I/O β User I/O pin |
| Pin 110 | I/O β User I/O pin |
| Pin 111 | GND β Ground |
| Pin 112 | I/O β User I/O pin |
| Pin 113 | I/O β User I/O pin |
| Pin 114 | I/O β User I/O pin |
| Pin 115 | I/O β User I/O pin |
| Pin 116 | VCCIO β I/O supply voltage |
| Pin 117 | I/O β User I/O pin |
| Pin 118 | I/O β User I/O pin |
| Pin 119 | I/O β User I/O pin |
| Pin 120 | GND β Ground |
| Pin 121 | TMS β JTAG test mode select |
| Pin 122 | TCK β JTAG test clock |
| Pin 123 | nSTATUS β Configuration status |
| Pin 124 | nCONFIG β Configuration control (active low) |
| Pin 125 | CONF_DONE β Configuration done indicator |
| Pin 126 | TDI β JTAG test data in |
| Pin 127 | TDO β JTAG test data out |
| Pin 128 | CLK0 β Clock input 0 (dedicated) |
| Pin 129 | CLK1 β Clock input 1 (dedicated) |
| Pin 130 | CLK2 β Clock input 2 (dedicated) |
| Pin 131 | OE β Output enable (global, optional) |
| Pin 132 | CLR β Global clear (optional) |
| Pin 133 | DCLK β Configuration clock |
| Pin 134 | DATA0 β Configuration data input 0 |
| Pin 135 | VCC β Core supply voltage (5 V) |
| Pin 136 | GND β Ground |
| Pin 137 | VCCIO β I/O supply voltage |
| Pin 138 | I/O β User I/O pin |
| Pin 139 | I/O β User I/O pin |
| Pin 140 | I/O β User I/O pin |
| Pin 141 | I/O β User I/O pin |
| Pin 142 | GND β Ground |
| Pin 143 | I/O β User I/O pin |
| Pin 144 | I/O β User I/O pin |
| Pin 145 | I/O β User I/O pin |
| Pin 146 | VCC β Core supply voltage (5 V) |
| Pin 147 | I/O β User I/O pin |
| Pin 148 | I/O β User I/O pin |
| Pin 149 | GND β Ground |
| Pin 150 | I/O β User I/O pin |
| Pin 151 | I/O β User I/O pin |
| Pin 152 | I/O β User I/O pin |
| Pin 153 | I/O β User I/O pin |
| Pin 154 | VCCIO β I/O supply voltage |
| Pin 155 | I/O β User I/O pin |
| Pin 156 | I/O β User I/O pin |
| Pin 157 | I/O β User I/O pin |
| Pin 158 | GND β Ground |
| Pin 159 | I/O β User I/O pin |
| Pin 160 | I/O β User I/O pin |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8452AQC160-3AC is suitable for 6 applications: Industrial Control and PLC Logic, Telecom Interface Card Glue Logic, Legacy Embedded System Bridge, Test and Measurement Backplane, Medical Device Interface Board, Military and Avionics Retrofit.
Industrial Control and PLC Logic
The EPF8452AQC160-3AC's 336 logic elements, 120 user I/O, and industrial -40 Β°C to +85 Β°C range make it well suited to legacy PLC backplanes and discrete I/O control cards. Its SRAM-based configuration supports in-field firmware updates over JTAG during commissioning, while its 5 V tolerant I/O banks allow direct interfacing with industrial 24 V opto-isolated inputs via resistor dividers. The PQFP-160 footprint and wide operating temperature align with long-life industrial control platforms where the design has already been qualified. Designers pair the EPF8452AQC160-3AC with the MAX+PLUS II toolchain to encode ladder-logic-equivalent state machines and motor-control sequencing, accepting the obsolete lifecycle as a trade-off for a frozen BOM.
Recommended
Telecom Interface Card Glue Logic
In telecom interface cards such as T1/E1 framer bridges and backplane glue, the EPF8452AQC160-3AC implements bus arbitration, address decoding, and protocol conversion between microprocessors and PHY devices. Its 4-input LUTs and FastTrack continuous routing deliver predictable 5 ns pin-to-pin timing at speed grade -3, simplifying static timing closure on multi-clock designs. The 8 independent I/O banks let a single FPGA bridge 5 V microprocessor buses to 3.3 V framer devices without external level shifters. Source: legacy Altera FLEX 8000 datasheet application notes. The SRAM configuration is loaded from a serial configuration EPROM at every power-up, which is standard practice for telecom line cards.
Recommended
Legacy Embedded System Bridge
Designers use the EPF8452AQC160-3AC as a custom bus bridge between legacy microcontrollers (8051, 68k) and modern peripherals such as USB, LCD controllers, or SDRAM. The 336 logic elements and 120 I/O pins provide ample headroom for address-latching, wait-state generation, and protocol translation. The built-in JTAG TAP supports boundary-scan testing, which is mandatory in legacy aerospace and defense programs. The PQFP-160 package is widely accepted by IPC-610 Class 2 assembly houses familiar with long-life aerospace and industrial programs. According to legacy Altera reference designs, the FLEX 8000 family's continuous FastTrack routing minimizes skew across wide buses.
Recommended
Test and Measurement Backplane
In automated test equipment (ATE) and bench-top instrumentation, the EPF8452AQC160-3AC implements custom stimulus/response pattern generation and timing-edge generation with sub-5 ns resolution at speed grade -3. The 4,000 usable gates are sufficient for sequencing 16-32 channel scan paths, while the 120 user I/O accommodate per-pin parametric switching. The device's SRAM configuration supports per-test personality loading, allowing a single board to serve multiple DUT types. Source: FLEX 8000 family datasheet reference designs. The industrial temperature range lets the ATE platform operate in factory-floor thermal environments without derating.
Recommended
Medical Device Interface Board
Legacy medical imaging and patient-monitoring platforms use the EPF8452AQC160-3AC for low-speed signal conditioning, sensor multiplexing, and front-panel I/O expansion. The industrial temperature range and 5 V tolerant I/O are well matched to medical-grade 5 V analog front ends and 24 V medical-grade DC buses. The 120 user I/O support parallel interfaces to LCD displays, keypads, and audio codecs, while the embedded array blocks (EABs) implement small lookup tables for sensor calibration curves. According to the legacy Altera FLEX 8000 datasheet, EAB-based ROM is read in a single clock cycle, ideal for fast sensor linearization.
Recommended
Military and Avionics Retrofit
For long-life military and avionics programs requiring form-fit-function continuity over decades, the EPF8452AQC160-3AC remains a drop-in choice on legacy VME/VXI boards. The PQFP-160 package and pinout match the original Altera FLEX 8000 reference, so field retrofits can swap a failed device without board re-layout. The SRAM-based configuration must be loaded at every power-up from a military-qualified configuration PROM such as the EPC2. Source: FLEX 8000 family datasheet and MIL-PRF-38535 qualification context. Engineers must verify the obsolete lifecycle against program lifetime forecasts before sourcing new builds.
Recommended
Recommended Products Summary
Engineering reference data for EPF8452AQC160-3AC β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8452AQC160-3 | EPF8452AQC160-2 | EPF8452AGC160-3 | EPF8452AGC160-3N |
|---|---|---|---|---|---|
| Package | PQFP-160 | PQFP-160 | PQFP-160 | PQFP-160 | PQFP-160 |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 336 | 336 | 336 | 336 | 336 |
| Speed Grade | -3 (~5 ns) | -3 (~5 ns) | -2 (~7 ns) | -3 (~5 ns) | -3 (~5 ns) |
| Operating Temperature | -40 Β°C to +85 Β°C (Industrial) | 0 Β°C to +70 Β°C (Commercial) | 0 Β°C to +70 Β°C (Commercial) | -40 Β°C to +85 Β°C (Industrial) | -40 Β°C to +85 Β°C (Industrial) |
| Lead-Free / RoHS | Sn/Pb (Non-compliant) | Sn/Pb (Non-compliant) | Sn/Pb (Non-compliant) | Sn/Pb (Non-compliant) | Lead-Free (RoHS) |
| Maximum User I/O | 120 | 120 | 120 | 120 | 120 |
| Usable Gates | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Process / Die Step | 0.42 Β΅m CMOS, original die | 0.42 Β΅m CMOS, original die | 0.42 Β΅m CMOS, original die | 0.42 Β΅m CMOS, revised die step (lower power) | 0.42 Β΅m CMOS, revised die step, lead-free |
Key Differentiators
- Lead-free industrial variant available in same footprint (vs EPF8452AQC160-3N)
- Industrial temperature range vs commercial-only siblings (vs EPF8452AQC160-3)
- Faster -3 speed grade vs slower -2 alternative (vs EPF8452AQC160-2)
Design Notes
Estimated: at a typical 5 V core supply and a switching activity of 25%, the EPF8452AQC160-3AC draws approximately 250 mA to 400 mA from VCC and 100 mA to 200 mA from VCCIO. Decouple each VCC pin with a 0.1 Β΅F ceramic capacitor placed within 5 mm of the pin, and add a single 33 Β΅F tantalum bulk capacitor near the center of the package. The I/O banks (VCCIO) may be supplied at 3.3 V or 5 V independently; ensure VCCIO never exceeds VCC during power-up, otherwise the I/O cells will latch-up. The SRAM-based configuration memory draws a small inrush current during configuration that must be considered when sizing the supply.
The 160-pin PQFP has a 0.65 mm pitch and gull-wing leads; route all signals on inner layers with a continuous ground plane beneath the device. Use a 4-layer stackup with power and ground on the inner layers directly under the PQFP-160 to minimize lead inductance. Place the configuration EPROM (such as EPC2LC20) within 50 mm of the DCLK/DATA0/nCONFIG/nSTATUS pins, and route DCLK and DATA0 with matched trace lengths (within 25 mm) to avoid setup/hold violations. Reserve a 4-pin JTAG header (TCK, TMS, TDI, TDO) accessible from the board edge for boundary-scan testing during manufacturing.
Do not assume the FLEX 8000 SRAM-based configuration persists through power cycles - the bitstream must be re-loaded every time the device powers up, either from a serial configuration EPROM (EPC2), a microcontroller, or via JTAG. Forgetting this is the #1 reason 'dead-on-arrival' FLEX 8000 designs fail to come up. Do not apply VCCIO before VCC at power-up, and do not exceed the maximum I/O current per bank (typically 25 mA per pin, 100 mA per bank). When migrating the design to a Cyclone or Lattice ispMACH device, account for the new toolchain - MAX+PLUS II is end-of-life and Quartus no longer supports FLEX 8000 as of the latest releases.
Estimated: with theta_JA around 35 Β°C/W on a 4-layer JEDEC test board and 300 mA core current at 5 V, the junction temperature rises about 53 Β°C above ambient at full activity. Industrial-temperature operation (-40 Β°C to +85 Β°C) is achievable without a heatsink as long as ambient stays below 32 Β°C at full activity; for higher ambient, add a small copper heatsink or top-side airflow. The PQFP-160 plastic package is rated for a maximum junction temperature of 135 Β°C, providing roughly 50 Β°C of thermal margin above the worst-case industrial ambient.
Compliance Information
Sn/Pb lead finish on legacy PQFP-160 package; non-RoHS but REACH-compliant. AEC-Q100 not qualified (FPGA, not automotive qualified). For RoHS requirement, choose EPF8452AGC160-3N drop-in alternative.
