EPF8636AQC160-4N vs EPF8636AQC160-3 Comparison
Detailed side-by-side comparison of EPF8636AQC160-4N by Intel and EPF8636AQC160-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF8636AQC160-4N | EPF8636AQC160-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 8000 | FLEX 8000 |
| Logic Cells / Elements | 504 | 504 |
| Usable Gates | 6,000 (typical) | 6,000 |
| User I/Os | 118 | 118 |
| Package | 160-pin PQFP (Plastic Quad Flat Pack) | 160-pin PQFP / BQFP (28 × 28 mm) |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS |
| Supply Voltage (VCCINT / VCCIO) | 5 V | — |
| I/O Logic Compatibility | 5.0 V and 3.3 V | — |
| Maximum Internal Frequency | 125 MHz | — |
| Typical Fmax (register-rich) | 83 MHz | — |
| Configuration Method | SRAM, loaded from parallel EPROM or serial EPC1/EPC1064/EPC1213/EPC1441 | SRAM, JTAG (IEEE 1149.1) / Serial EPROM |
| Boundary-Scan Test | JTAG IEEE Std. 1149.1-1990 (on selected devices) | — |
| Bus Compliance | PCI Local Bus Specification (PCI SIG) | — |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| In-Circuit Reconfigurability | Yes (ICR) | — |
| Mounting Type | Surface Mount (gull-wing leads) | Surface Mount (Gull-Wing) |
| RoHS Status | unknown | [DATA_NEEDED: RoHS status] |
| Logic Array Blocks (LABs) | — | 63 |
| Embedded SRAM | — | 4,992 bits |
| Maximum Frequency | — | 125 MHz |
| Supply Voltage | — | 5 V (4.75 V to 5.25 V) |
| Boundary-Scan Support | — | Yes (JTAG) |