EPF8820ABC225-4 vs EPF8636AQC208-4N Comparison

Detailed side-by-side comparison of EPF8820ABC225-4 by Intel and EPF8636AQC208-4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF8820ABC225-4 EPF8636AQC208-4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $14.20 $10.40
Family FLEX 8000 FLEX 8000
Device Logic Elements 672 cells β€”
Typical Gates 8,000 β€”
Logic Array Blocks (LABs) 84 β€”
User I/Os 152 β€”
Process Technology 0.42 Β΅m CMOS 0.42 Β΅m CMOS
Supply Voltage 4.75 V to 5.25 V (5 V nominal) 5 V (4.75 V to 5.25 V)
Operating Frequency 125 MHz β€”
Speed Grade -4 β€”
Package 225-ball BGA (BC225), 19 x 19 mm 208-pin PQFP (28x28 mm)
Package Type Surface-mount BGA, ball grid array β€”
Operating Temperature 0 Β°C to +70 Β°C (commercial) 0 Β°C to 70 Β°C (Commercial)
Configuration Method SRAM (volatile, reconfigure at power-up) In-Circuit Reconfigurability (ICR)
LUT Architecture 4-input look-up table with programmable register β€”
RoHS Status unknown unknown
Lead-Free unknown β€”
MSL Level [DATA_NEEDED: MSL moisture sensitivity level] β€”
Usable Gates β€” 6,000
Logic Cells / Logic Elements β€” 504
Maximum Operating Frequency β€” 125 MHz
User I/Os (max) β€” 136
Terminal Form β€” Gull wing
Logic Family β€” CMOS
Programmable Logic Blocks β€” Look-Up Table (LUT) based
Mounting Type β€” Surface Mount
Temperature Grade β€” COMMERCIAL
Package Code β€” FQFP

Datasheets & Resources

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