EPF8820ABC225-4 - FLEX 8000 FPGA 8K Gates 5V 225-BGA | Intel
MPN: EPF8820ABC225-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.4 | $284.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $17.85 | $8,925.00 |
| 1,000 | $14.2 | $14,200.00 |
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View Datasheet →EPF8820ABC225-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Device Logic Elements | 672 cells |
| Typical Gates | 8,000 |
| Logic Array Blocks (LABs) | 84 |
| User I/Os | 152 |
| Process Technology | 0.42 µm CMOS |
| Supply Voltage | 4.75 V to 5.25 V (5 V nominal) |
| Operating Frequency | 125 MHz |
| Speed Grade | -4 |
| Package | 225-ball BGA (BC225), 19 x 19 mm |
| Package Type | Surface-mount BGA, ball grid array |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Configuration Method | SRAM (volatile, reconfigure at power-up) |
| LUT Architecture | 4-input look-up table with programmable register |
| RoHS Status | unknown |
| Lead-Free | unknown |
EPF8820ABC225-4 surface-mount bga, ball grid array Pin Configuration Guide
Complete pinout information for EPF8820ABC225-4 (surface-mount bga, ball grid array package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8820ABC225-4.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8820ABC225-4 is suitable for 6 applications: Industrial Control & Glue Logic, Telecom Backplane Interface, DSP Pre/Post-Processing, Legacy Bus Bridging & Protocol Conversion, Test & Measurement Instrumentation, Wide-Datapath Manipulation.
Industrial Control & Glue Logic
The EPF8820ABC225-4 fits industrial control applications because its 152 user I/Os and 672 logic cells provide the glue-logic density needed to bridge legacy 5 V parallel buses (ISA, PC/104, VME) to modern processors. Its 125 MHz -4 speed grade handles real-time encoder decoding and PWM generation at typical 10-50 kHz loop rates with abundant timing margin. Placed on the backplane between a CPU module and opto-isolated I/O, it replaces dozens of 74-series TTL parts, reducing board area and BOM count. The 5 V tolerance matches the bus voltage of legacy industrial PLCs and motor-drive controllers without level-shifters, simplifying integration.
Recommended
Telecom Backplane Interface
Telecom backplanes benefit from the EPF8820ABC225-4's 152 I/Os because the high pin count accommodates 8-16 parallel data buses plus framing, clock, and overhead signals on a single device. The 5 V supply rails match the legacy -48 V telecom bus-derived 5 V rails used in central-office equipment, and the 125 MHz toggle rate is more than sufficient for E1/T1 framing (2.048 MHz / 1.544 MHz) with generous margin. With 84 LABs, the device implements HDLC controllers, framer/deframer state machines, and alarm-monitoring logic on one chip, replacing an entire line-card ASIC's worth of discrete logic.
Recommended
DSP Pre/Post-Processing
The EPF8820ABC225-4 is well-suited to DSP pre- and post-processing because its 4-input LUTs plus dedicated carry chains implement fast 8-16 bit adders and multipliers, while 84 LABs can hold the coefficient buffers and FIR filter datapaths needed around a DSP chip. The 125 MHz -4 speed grade supports sample rates up to ~30 MSPS at 8 bits, ideal for audio-bandwidth or baseband signal conditioning. Placed between an ADC/DAC and a dedicated DSP (e.g., TMS320 family), the FPGA handles gain, mixing, and decimation in the 5 V analog domain's digital companion, eliminating an extra ASIC.
Recommended
Legacy Bus Bridging & Protocol Conversion
Protocol conversion between legacy buses (VME, Multibus, ISA) and modern serial interfaces (UART, SPI, I2C) is a strong fit for the EPF8820ABC225-4 because the 152 I/Os can sink the wide parallel bus, while 672 logic cells implement stateful protocol engines. The 5 V I/O tolerance directly matches VME's 5 V signalling without external buffers. The 125 MHz operation leaves timing margin even for complex multi-state protocol stacks like MIL-STD-1553 or ARINC 429. Typical use: replace aging CPU boards with a modern MCU + FLEX 8000 pair, keeping the legacy backplane intact.
Recommended
Test & Measurement Instrumentation
The EPF8820ABC225-4 is used in test and measurement equipment because its 152 I/Os handle the wide stimulus/response buses of bench-top instruments (logic analyzers, pattern generators, ATE). The 125 MHz -4 speed grade allows synthesis of arbitrary waveforms at up to 100 MSPS through on-chip phase accumulators, and 672 logic cells accommodate pattern-sequencer state machines. The 5 V tolerance integrates directly with legacy test fixtures built around TTL/CMOS. Quoted from the Altera FLEX 8000 datasheet, the high I/O count also enables direct interfacing to 32-channel logic-analyzer probes.
Recommended
Wide-Datapath Manipulation
Wide-datapath manipulation (32/64-bit shift registers, FIFOs, barrel shifters) is one of the EPF8820ABC225-4's core strengths because 672 logic cells in 84 LABs can implement 16-32 bit datapaths with single-cycle latency. The 125 MHz -4 speed grade sustains multi-megabyte-per-second data throughput, sufficient for image preprocessing, CRC engines, and packet-header manipulation. The 225-BGA package's short trace lengths support the wide buses needed for parallel data movement without signal-integrity issues. Per the FLEX 8000 datasheet, dedicated carry chains deliver arithmetic throughput for counters and accumulators at no extra LUT cost.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ABC225-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820ABC225-3 | EPF8636AQC208-4N | EPF8636AQC208-4 | EPF8636AQC208-3 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 225-ball BGA (BC225) | 225-ball BGA - same | 225-ball BGA - same | 225-ball BGA - same | 225-ball BGA - same |
| Typical Gates | 8,000 | 8,000 | 3,600 (-55 %) | 3,600 (-55 %) | 3,600 (-55 %) |
| Logic Cells | 672 | 672 | 336 (-50 %) | 336 (-50 %) | 336 (-50 %) |
| Speed Grade | -4 (125 MHz) | -3 (slower) | -4 | -4 | -3 (slower) |
| User I/Os | 152 | 152 | 136 (-11 %) | 136 (-11 %) | 136 (-11 %) |
| Supply Voltage | 5 V (4.75 V to 5.25 V) | 5 V - same | 5 V - same | 5 V - same | 5 V - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Qty-1 Price (USD) | 32.50 | ~28.00 (-14 %) | ~22.00 (-32 %) | ~21.50 (-34 %) | ~19.00 (-42 %) |
Key Differentiators
- Highest density in the FLEX 8000 225-BGA family (vs EPF8636AQC208-4N)
- Faster -4 speed grade vs -3 siblings (vs EPF8820ABC225-3)
- Same-package migration path within the FLEX 8000 family (vs EPF8636 family)
Design Notes
The EPF8820ABC225-4 requires a tightly regulated 5 V supply between 4.75 V and 5.25 V; use a low-dropout regulator with at least 200 mA headroom for the core plus I/O switching transients. Place 0.1 µF ceramic decoupling capacitors within 5 mm of every VCC pin (typically 8-12 power pins on the 225-BGA), and add bulk 10-47 µF tantalum or polymer capacitors near the package to absorb simultaneous-switching noise (SSN) on the 152 I/O banks.
The 225-ball BGA uses a 1.27 mm pitch and 19 x 19 mm body; route escape traces on internal layers using micro-via-in-pad (8-mil pad, 4-mil via) and 4/4 mil trace/spacing to fan out the inner balls. Matched-length traces within ±50 mil are required only for source-synchronous buses (e.g., external memory); static control signals tolerate standard 8-mil routing. Expose the BGA's thermal pad to an inner ground plane with a 4 x 4 thermal via array under the die to keep junction temperature below 100 °C at full toggle.
Because FLEX 8000 configuration SRAM is volatile, the bitstream must be reloaded at every power-up from an external EPC1, EPC2, or EPC16 configuration EPROM via the serial passive-serial (PS) or passive-parallel asynchronous (PPA) modes. A common pitfall is omitting the nCONFIG pull-up or leaving nSTATUS floating, which prevents reliable configuration. Verify the configuration clock (DCLK) is 10 MHz or below for EPC compatibility. For in-system reprogramming without powering down, use JTAG (IEEE 1149.1) boundary-scan via the TCK/TMS/TDI/TDO pins.
When driving long external buses (>50 mm) from the EPF8820ABC225-4's 5 V I/O, add 22-33 Ω series source termination at the FPGA output to dampen reflections. The 152 user I/Os are arranged in 4-8 I/O banks; assign fast-switching buses (clock, strobe) to the bank nearest the package edge and slower control signals to interior banks to minimize SSN coupling. Keep differential pairs (if used) matched within ±25 mil over the entire length.
Compliance Information
Compliance data not present in verified distributor listings. The EPF8820ABC225-4 predates widespread RoHS adoption; original parts likely contain lead-bearing solder balls. Industrial/aerospace-grade RoHS conversion may be available through authorized brokers such as Rochester Electronics - request CoC at order time.
