EPM570F256C3 vs EPM570F256C5 Comparison

Detailed side-by-side comparison of EPM570F256C3 by Intel and EPM570F256C5 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM570F256C3 EPM570F256C5
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family MAX II —
Device Type CPLD (Complex Programmable Logic Device) —
Logic Elements / Macro Cells 440 Logic Elements (~570 macro cells equivalent) —
Maximum Operating Frequency 304 MHz 201.1 MHz
Propagation Delay (tPD) [DATA_NEEDED: tPD in ns] —
User I/O Count 80 (max for F256 package) —
User Flash Memory 8 Kbits 8 Kbit
Supply Voltage - Core 2.5 V / 3.3 V (MultiVolt core) —
Supply Voltage - I/O 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) —
Process Technology 0.18 µm 0.18 µm
Package 256-FBGA (FineLine BGA) 17 × 17 mm 256-ball FBGA
Mounting Type Surface Mount Surface Mount
Programming Interface JTAG (IEEE 1149.1) - ISP —
Configuration Memory Non-volatile on-chip flash —
Operating Temperature Commercial: 0 °C to +85 °C (C3 grade) 0 °C to +85 °C (Commercial)
RoHS Status Compliant —
Lead-Free Yes —
Design Software Quartus II / Quartus Prime (legacy support) —
Series — MAX II
Logic Elements — 570
Macro Cells — 440
User I/O — 160
Supply Voltage - Internal — 2.5 V / 3.3 V
Propagation Delay (tPD max) — 5.4 ns
Programmable Type — In System Programmable (Flash)
JTAG Support — IEEE 1149.1
Speed Grade — C5 (5 ns)

Datasheets & Resources

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