EPM570F256C3 vs EPM570F256C5 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570F256C3 disebabkan oleh Intel dan EPM570F256C5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570F256C3 | EPM570F256C5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements / Macro Cells | 440 Logic Elements (~570 macro cells equivalent) | — |
| Maximum Operating Frequency | 304 MHz | 201.1 MHz |
| Propagation Delay (tPD) | [DATA_NEEDED: tPD in ns] | — |
| User I/O Count | 80 (max for F256 package) | — |
| User Flash Memory | 8 Kbits | 8 Kbit |
| Supply Voltage - Core | 2.5 V / 3.3 V (MultiVolt core) | — |
| Supply Voltage - I/O | 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.18 µm | 0.18 µm |
| Kemasan | 256-FBGA (FineLine BGA) 17 × 17 mm | 256-ball FBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) - ISP | — |
| Configuration Memory | Non-volatile on-chip flash | — |
| Suhu Operasi | Commercial: 0 °C to +85 °C (C3 grade) | 0 °C to +85 °C (Commercial) |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Design Software | Quartus II / Quartus Prime (legacy support) | — |
| Series | — | MAX II |
| Logic Elements | — | 570 |
| Macro Cells | — | 440 |
| User I/O | — | 160 |
| Supply Voltage - Internal | — | 2.5 V / 3.3 V |
| Propagation Delay (tPD max) | — | 5.4 ns |
| Programmable Type | — | In System Programmable (Flash) |
| JTAG Support | — | IEEE 1149.1 |
| Speed Grade | — | C5 (5 ns) |