EPM570F256C3 - MAX II CPLD, 440 Logic Elements, 256-FBGA | Intel
MPN: EPM570F256C3 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.25 | $202.50 |
| 100 | $18 | $1,800.00 |
| 500 | $16.2 | $8,100.00 |
| 1,000 | $14.85 | $14,850.00 |
Drop-in alternatives for EPM570F256C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM570F256C5
✅ Drop-In✓ In Stock
$7.1 / Unit
View Datasheet →EPM570F256I5N
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EPM570F100C5N
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →EPM570F100C4N
✅ Drop-In✓ In Stock
$14.32 / Unit
View Datasheet →EPM570F100A5N
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →EPM570F256C3 Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements / Macro Cells | 440 Logic Elements (~570 macro cells equivalent) |
| Maximum Operating Frequency | 304 MHz |
| User I/O Count | 80 (max for F256 package) |
| User Flash Memory | 8 Kbits |
| Supply Voltage - Core | 2.5 V / 3.3 V (MultiVolt core) |
| Supply Voltage - I/O | 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) |
| Process Technology | 0.18 µm |
| Package | 256-FBGA (FineLine BGA) 17 × 17 mm |
| Mounting Type | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) - ISP |
| Configuration Memory | Non-volatile on-chip flash |
| Operating Temperature | Commercial: 0 °C to +85 °C (C3 grade) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Design Software | Quartus II / Quartus Prime (legacy support) |
EPM570F256C3 256-fbga (fineline bga) 17 × 17 mm Pin Configuration Guide
Complete pinout information for EPM570F256C3 (256-fbga (fineline bga) 17 × 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570F256C3.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570F256C3 is suitable for 6 applications: I/O Expansion and Bus Bridging, Power-Up Sequencing for Multi-Rail Systems, Glue Logic Replacement (74-Series TTL), Motor Control State Machines, LED Display Driver Logic, Industrial Control and Factory Automation.
I/O Expansion and Bus Bridging
The EPM570F256C3 is widely deployed as a bus-bridging CPLD between processors and peripherals that use mismatched protocols (e.g. parallel-to-SPI, I2C-to-GPIO, or memory-bus-to-ADC). Its 440 Logic Elements and 80 user I/Os provide enough headroom to implement multi-channel bridges with deterministic timing. The non-volatile instant-on configuration means no external boot ROM is required, simplifying board design. Quartus II HDL development supports Verilog/VHDL state machines for protocol conversion at clock rates well above the 304 MHz fabric maximum.
Recommended
Power-Up Sequencing for Multi-Rail Systems
Multi-rail systems (FPGA + DDR + analog + transceivers) require deterministic rail sequencing during power-up to prevent latch-up and in-rush damage. The EPM570F256C3 implements the sequencer with non-volatile flash memory, ensuring the sequence executes within microseconds of VCC applied. The 80 user I/Os can drive dozens of enable signals and monitor PGOOD flags. The MultiVolt I/O architecture (1.8/2.5/3.3 V) interfaces directly with each rail's controller without level shifters, reducing BOM cost in telecom and industrial platforms.
Recommended
Glue Logic Replacement (74-Series TTL)
The EPM570F256C3 replaces dozens of discrete 74-series TTL/CMOS packages (AND/OR gates, muxes, decoders, flip-flops, counters) with a single programmable device. 440 Logic Elements map to roughly 570 macro cells, sufficient to absorb entire boards of glue logic while reducing board area and BOM count. Deterministic 4-7 ns propagation delays match discrete-logic timing, and the non-volatile configuration eliminates manual jumper wiring. Quartus II schematic capture supports legacy designers migrating from discrete schematics.
Recommended
Motor Control State Machines
Stepper and BLDC motor controllers require deterministic PWM generation and commutation state machines. The EPM570F256C3 implements the commutation logic, fault handling, and PWM dead-time insertion in a single CPLD, offloading the microcontroller. 304 MHz fabric performance supports multi-axis control with sub-microsecond PWM resolution. The 80 user I/Os drive MOSFET gate drivers, encoder inputs, and Hall-sensor feedback. Non-volatile flash configuration ensures the motor controller starts cleanly on every power cycle without firmware boot delay.
Recommended
LED Display Driver Logic
Large LED matrix displays require row/column scanning, brightness (PWM) control, and refresh logic that exceeds the capability of typical microcontrollers. The EPM570F256C3 implements multi-channel PWM, scan timing, and data multiplexing for displays up to thousands of pixels. The 80 user I/Os handle multiple data and address lines in parallel, while the deterministic 304 MHz fabric eliminates visible flicker. MultiVolt I/O interfaces directly with 3.3 V LED driver ICs and 5 V level shifters for stadium and signage applications.
Recommended
Industrial Control and Factory Automation
Factory automation controllers require rugged, deterministic logic that operates reliably in electrically noisy environments. The EPM570F256C3 implements safety interlocks, machine state sequencing, and protocol conversion (RS-232/485, Modbus, Profibus glue) with deterministic timing. Its non-volatile configuration ensures the machine state machine boots correctly even after power loss. Industrial grade variants (EPM570F256I5N) extend operation to -40 °C to +100 °C for outdoor and factory-floor deployment with high immunity to electrical noise.
Recommended
Recommended Products Summary
Engineering reference data for EPM570F256C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570F256C5 | EPM570F256I5N | EPM570F100C5N | EPM570F100C4N | EPM570F100A5N |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (FineLine BGA) 17x17 mm | 256-FBGA (FineLine BGA) 17x17 mm - same | 256-FBGA (FineLine BGA) 17x17 mm - same | 100-pin EQFP - different package | 100-pin EQFP - different package | 100-pin EQFP - different package |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) - same brand | Intel (formerly Altera) - same brand | Intel (formerly Altera) - same brand | Intel (formerly Altera) - same brand | Intel (formerly Altera) - same brand |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Logic Elements | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/O (max) | 80 | 80 | 80 | 76 | 76 | 76 |
| Speed Grade | C3 | C5 (faster) | I5 (faster, industrial) | C5 | C4 | A5 (lower power) |
| Temperature Grade | Commercial 0 to +85 C | Commercial 0 to +85 C | Industrial -40 to +100 C | Commercial 0 to +85 C | Commercial 0 to +85 C | Commercial 0 to +85 C |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Programming Interface | JTAG (IEEE 1149.1) ISP | JTAG ISP | JTAG ISP | JTAG ISP | JTAG ISP | JTAG ISP |
Key Differentiators
- Highest-density MAX II commercial-grade variant in the 256-FBGA package (vs EPM570F100C5N)
- Industrial-temperature upgrade available with pin-compatible footprint (vs EPM570F256I5N)
- Faster speed grade available without changing footprint (vs EPM570F256C5)
Design Notes
The 256-FBGA FineLine BGA uses 1.0 mm ball pitch and requires 4-6 layer PCB with microvia or via-in-pad construction for reliable assembly. Provide at least one 0.1 µF decoupling capacitor per power-pin pair, placed within 2-3 mm of the BGA balls. Reference Intel/Altera AN-441 for detailed BGA fanout and stackup recommendations. Estimated: power-pin count is approximately 12-16 VCCINT/VCCIO pairs based on typical MAX II F256 pinout.
Route JTAG signals (TCK, TMS, TDI, TDO) as a matched-length group and place a 4.7 kΩ pull-up on TCK. Use series-termination resistors (33 Ω typical) on high-speed clock inputs feeding the CPLD to dampen ringing. Tie unused user I/Os to a defined logic state (do not leave them floating) to minimize quiescent current. MultiVolt I/O banks must be powered even if unused, or all pins in that bank behave as inputs.
Do not confuse the C3 speed grade with the I3 industrial grade - C3 means commercial temperature with the slowest C-speed timing. For JTAG ISP, ensure nCE (chip enable) is tied low during programming and pulled high only for boundary-scan. Estimate: non-volatile flash configuration completes in under 100 µs, but external reset supervisor is recommended for systems requiring longer power-on reset hold times.
Keep the JTAG header accessible on the PCB for in-system programming and factory test. Provide a 10 kΩ pull-up on nCONFIG and a 10 kΩ pull-down on nSTATUS for clean configuration handshaking. Differential clock pairs, if used, should be length-matched to within 150 mil. Reference the Quartus II Pin Planner for per-pin MultiVolt I/O bank assignments before finalizing the schematic.
Compliance Information
RoHS compliant and lead-free per Altera/Intel MAX II product family datasheet. AEC-Q100 not applicable - this is a commercial-grade CPLD. For automotive-grade applications, contact Intel/Altera authorized distributors for AEC-Q100 qualified MAX II variants.
