EPM570F256C4 vs 5M570ZF256C5N Comparison

Detailed side-by-side comparison of EPM570F256C4 by Intel and 5M570ZF256C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM570F256C4 5M570ZF256C5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family MAX II MAX V
Device Name EPM570 —
Logic Elements (LEs) 570 —
Maximum User I/O Pins 212 —
User Flash Memory 8 Kbits 8 Kbit
Pin-to-Pin Logic Delay (tPD) 4.5 ns (commercial -4 speed grade) —
Supply Voltage - Core (VCCINT) 1.8 V —
Supply Voltage - I/O (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V —
Programming Interface JTAG (IEEE 1149.1), in-system programmable JTAG (IEEE 1149.1) / ISP
Operating Temperature 0C to +85C (commercial) —
Package 256-ball FineLine BGA (F256) —
Mounting Type Surface Mount Surface Mount (BGA)
MSL Level 3 (168 hours) 3 (per JEDEC J-STD-020)
Lead-Free / RoHS Yes (lead-free finish, RoHS compliant per product page) —
Configuration Memory Internal Flash (non-volatile, instant-on) On-chip non-volatile flash
Global Clock Networks 4 —
Logic Elements (LE) — 570
Macro Cells — 440
Maximum User I/Os — 159
Number of Pins — 256
Package Type — FBGA-256 (FineLine BGA)
Supply Voltage — 1.8 V core (3.3 V I/O supported via internal LDO)
Operating Frequency (fMAX) — 118.3 MHz
Propagation Delay (tPD) — 8.5 ns (commercial speed grade 5)
Operating Temperature Range — 0C to +85C (commercial)
RoHS Status — Compliant
Lead-Free — Yes

Datasheets & Resources

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