EPM570F256C4 - 570 LEs MAX II CPLD, 256-FBGA | Intel
MPN: EPM570F256C4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $30.1 | $301.00 |
| 100 | $26.85 | $2,685.00 |
| 250 | $24.2 | $6,050.00 |
| 1,000 | $19.95 | $19,950.00 |
Drop-in alternatives for EPM570F256C4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM570F256C3
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EPM570F256C5N
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View Datasheet →EPM570F256C4 Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Name | EPM570 |
| Logic Elements (LEs) | 570 |
| Maximum User I/O Pins | 212 |
| User Flash Memory | 8 Kbits |
| Pin-to-Pin Logic Delay (tPD) | 4.5 ns (commercial -4 speed grade) |
| Supply Voltage - Core (VCCINT) | 1.8 V |
| Supply Voltage - I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Operating Temperature | 0C to +85C (commercial) |
| Package | 256-ball FineLine BGA (F256) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| Lead-Free / RoHS | Yes (lead-free finish, RoHS compliant per product page) |
| Configuration Memory | Internal Flash (non-volatile, instant-on) |
| Global Clock Networks | 4 |
EPM570F256C4 256-ball fineline bga (f256) Pin Configuration Guide
Complete pinout information for EPM570F256C4 (256-ball fineline bga (f256) package) with 212 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570F256C4.
Refer to the datasheet for full pin configuration.
Estimated pin count: 212 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570F256C4 is suitable for 6 applications: Power Sequencing and Reset Control, I/O Expansion and Bus Bridging, Industrial Control and Factory Automation, Networking Line Card Glue Logic, Test and Measurement Front-End Logic, Display and Touch-Panel Interface Bridging.
Power Sequencing and Reset Control
The EPM570F256C4's 570 LEs and 4.5 ns tPD logic delay make it well-suited for centralized power-sequencing and reset-distribution logic in multi-rail systems. A typical design uses the CPLD to monitor PG (power-good) signals from each DC-DC converter, then stagger the enable outputs by tens of milliseconds to enforce proper rail sequencing for processors, FPGAs, or DDR memories. The instant-on, non-volatile Flash configuration means the sequencer is operational within microseconds of VCCINT ramp - critical when downstream ICs cannot tolerate a long undefined reset window. The 212 user I/Os accommodate dozens of rails plus status LEDs and fault inputs, and JTAG boundary-scan assists board-level test.
Recommended
I/O Expansion and Bus Bridging
With 212 user I/Os and MultiVolt I/O banks that natively support 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5 V logic levels, the EPM570F256C4 is an excellent bus-bridging solution between microcontrollers, FPGAs, and legacy peripherals. Common implementations include SPI-to-parallel LCD bridges, I2C-to-GPIO expanders, and async FIFO bridges between domains running at different clock rates. The internal 8 Kbit user flash can store calibration or configuration data, and the four global clock networks simplify synchronous crossing logic. Pin-to-pin compatibility with the EPM1270 in the F256 package enables seamless capacity upgrade as bridging needs grow.
Recommended
Industrial Control and Factory Automation
The EPM570F256C4's industrial-temperature variants and robust 1.8 V core / MultiVolt I/O architecture support factory-automation designs such as PLC I/O modules, motor-driver front-end controllers, and machine-vision trigger generators. The 4.5 ns propagation delay is sufficient for encoder quadrature decoding at high RPM, PWM generation for servo loops, and deterministic interrupt-handling glue logic. Designers exploit the JTAG ISP capability to update field-deployed boards without removing them from the chassis - essential for retrofit programs. The F256 BGA package's fine pitch (1.0 mm) requires 6-8 layer PCB stack-ups typical of industrial control cards.
Recommended
Networking Line Card Glue Logic
In networking line cards and base-station designs, the EPM570F256C4 handles address decoding, chip-select generation, and bus-width adaptation between network processors (NPs), FPGAs, and packet-buffer memories. Its MultiVolt I/O banks bridge 2.5 V packet-buffer interfaces to 3.3 V PHY or backplane logic without external level shifters. The CPLD's deterministic timing supports hardware-queue pointer management and pause-frame generation, while the JTAG boundary-scan infrastructure integrates with board-level ATPG patterns. Vertical migration within the F256 footprint to EPM1270 or EPM2210 allows line-card platforms to scale capacity without re-routing the PCB.
Recommended
Test and Measurement Front-End Logic
The EPM570F256C4 is widely used in test-and-measurement instruments as a front-end pattern generator, multiplexer controller, and trigger-arming circuit. Its low propagation delay (4.5 ns) enables tight timing margins for sub-microsecond trigger events, while the 570 LEs accommodate modest state machines and waveform counters. Designers often use the CPLD to route internal test points to a smaller pin count or to multiplex multiple sensor inputs into a single high-speed ADC. The internal 8 Kbit user flash stores calibration constants read by the host at startup, eliminating an external EEPROM.
Recommended
Display and Touch-Panel Interface Bridging
The EPM570F256C4's high I/O count and MultiVolt I/O make it a strong fit for display-driver bridging, RGB-to-LVDS conversion glue logic, and capacitive-touch-panel scanning controllers. The CPLD can aggregate touch-sensor I2C or SPI inputs from multiple panels and present a unified interrupt to the host processor, reducing host wake-up events and saving power in handheld designs. The internal user flash holds panel-edid data or color-profile lookup values. The 256-ball BGA package, while fine-pitch, is standard in mid-density display controller boards where 6-layer stack-ups are already required for high-speed RGB traces.
Recommended
Recommended Products Summary
Engineering reference data for EPM570F256C4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570F256C3 | EPM570F256C3N | EPM1270F256C4 | EPM570F256C5N | EPM2210F256C4 | 5M570ZF256C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II | MAX V |
| Logic Elements (LEs) | 570 | 570 (same) | 570 (same) | 1270 (+123%) | 570 (same) | 2210 (+288%) | 570 (same) |
| Pin-to-Pin Logic Delay (tPD) | 4.5 ns (-C4) | 3.6 ns (-C3, +25% faster) | 3.6 ns (-C3, +25% faster) | 6.0 ns (-C4 at higher density) | 5.0 ns (-C5, -10% slower) | 7.0 ns (-C4 at higher density) | 5.0 ns (-C5) |
| User Flash Memory | 8 Kbits | 8 Kbits (same) | 8 Kbits (same) | 8 Kbits (same) | 8 Kbits (same) | 8 Kbits (same) | 0 Kbits (no user flash) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial, lead-free) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Key Differentiators
- Highest-density BGA package in the EPM570 family with maximum 212 user I/O pins (vs EPM570F100C4N (F100 BGA, 100 balls))
- Non-volatile Flash configuration with instant-on microsecond startup (vs Equivalent Lattice ispMACH 4000ZE CPLD with on-chip NV memory)
- Pin-compatible upgrade path to EPM1270 and EPM2210 in same F256 BGA (vs Other MAX II densities in smaller packages)
Design Notes
The F256 FineLine BGA package uses 1.0 mm ball pitch and requires a 6- or 8-layer PCB stack-up with matched-impedance traces and continuous ground planes for reliable assembly. Use via-in-pad or microvia fanout on at least the inner-row balls; standard dog-bone fanout at 1.0 mm pitch risks solder-bridge defects. Recommend NSMD (non-solder-mask-defined) BGA pads with 0.45 mm pad diameter to maximize the solder fillet and improve manufacturing yield per IPC-7351.
Provide separate 1.8 V VCCINT and 3.3 V VCCIO rails, each decoupled with a 1 uF ceramic capacitor within 100 mils of every supply pin plus a bulk 100 uF tantalum near the package. The MAX II MultiVolt I/O banks each have their own VCCIO pins and may run at independent voltages (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V); tie unused bank VCCIO to a valid rail rather than leaving floating. Allow >1 ms VCCINT ramp time before JTAG programming begins.
Common pitfalls when bringing up the EPM570F256C4: (1) forgetting to drive JTAG TCK with a clean 10 MHz clock during ISP - noisy TCK causes verify failures; (2) mixing single-ended I/O standards with differential (LVDS) on adjacent pins without proper VCCIO bank isolation; (3) leaving the nCONFIG pin floating rather than tying it to VCCINT through a 10 kohm pull-up; (4) using open-drain outputs without external pull-ups, which the MAX II does not provide internally on all pins.
For clock-distribution designs, route global clock inputs on dedicated CLK pins with 50 ohm controlled-impedance traces and length-match within 200 mils across the four global clock networks. Avoid routing clock signals across BGA inner rows where via stubs introduce reflections. The 4.5 ns tPD budget assumes worst-case commercial temperature and voltage; derate accordingly for industrial or extended temperature designs.
Compliance Information
RoHS compliant and lead-free per Intel product page. Halogen-free per material declaration. Standard commercial MAX II grade is not AEC-Q100 qualified; for automotive, choose the MAX II automotive-grade or MAX V AEC-Q100 variants.
