EPM570T100C3N vs EPM570T100C4N Comparison

Detailed side-by-side comparison of EPM570T100C3N by Intel and EPM570T100C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM570T100C3N EPM570T100C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family MAX II MAX II
Macro Cells 440 —
Logic Elements (LEs) 570 —
Maximum User I/Os 76 —
Pin-to-Pin Delay (tPD1) 5.4 ns —
Maximum Internal Frequency 304 MHz 247.5 MHz
User Flash Memory (UFM) 8 Kbits —
Number of LABs 57 —
Supply Voltage - Core 2.5 V / 3.3 V —
I/O Standards Supported 1.5 V, 1.8 V, 2.5 V, 3.3 V (MultiVolt) —
Process Technology 0.18 µm Flash 0.18 µm
Package 100-TQFP (T100) —
Mounting Type Surface Mount Surface Mount
Operating Temperature 0 °C to +85 °C (Commercial) 0 °C to 85 °C (TJ, commercial)
Programming Interface JTAG / IEEE 1149.1 boundary-scan —
In-System Programmable Yes —
RoHS Status Compliant Compliant
Speed Grade C3 —
Series — MAX® II
Logic Elements / Blocks — 570
Macrocells — 440
Number of User I/O — 76
Propagation Delay (tpd) — 5.4 ns (speed grade 4)
Supply Voltage - Internal — 2.5 V / 3.3 V
Programmable Type — In-System Programmable (Flash, non-volatile)
User Flash Memory — 8 Kbits
Package / Case — 100-TQFP (14 x 14 mm)
Supplier Device Package — 100-TQFP
Configuration Memory — Internal flash (no external PROM required)
JTAG / ISP — IEEE 1149.1 compliant
I/O Bank Voltages — 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Product Status — Active

Datasheets & Resources

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