EPM570T100C4N - MAX II CPLD, 570 LE, 440 Macrocells, TQFP-100 | Intel
MPN: EPM570T100C4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.2 | $14.20 |
| 10 | $12.78 | $127.80 |
| 100 | $11.36 | $1,136.00 |
| 500 | $10.1 | $5,050.00 |
| 1,000 | $9.05 | $9,050.00 |
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View Datasheet →EPM570T100C4N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Series | MAX® II |
| Logic Elements / Blocks | 570 |
| Macrocells | 440 |
| Number of User I/O | 76 |
| Propagation Delay (tpd) | 5.4 ns (speed grade 4) |
| Maximum Internal Frequency | 247.5 MHz |
| Process Technology | 0.18 µm |
| Supply Voltage - Internal | 2.5 V / 3.3 V |
| Programmable Type | In-System Programmable (Flash, non-volatile) |
| User Flash Memory | 8 Kbits |
| Operating Temperature | 0 °C to 85 °C (TJ, commercial) |
| Mounting Type | Surface Mount |
| Package / Case | 100-TQFP (14 x 14 mm) |
| Supplier Device Package | 100-TQFP |
| Configuration Memory | Internal flash (no external PROM required) |
| JTAG / ISP | IEEE 1149.1 compliant |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Product Status | Active |
| RoHS Status | Compliant |
EPM570T100C4N Pin Configuration
| Pin 1 | I/O — User I/O bank 1 |
| Pin 2 | I/O — User I/O bank 1 |
| Pin 3 | I/O — User I/O bank 1 |
| Pin 4 | I/O — User I/O bank 1 |
| Pin 5 | I/O — User I/O bank 1 |
| Pin 6 | I/O — User I/O bank 1 |
| Pin 7 | I/O — User I/O bank 1 |
| Pin 8 | I/O — User I/O bank 1 |
| Pin 9 | I/O — User I/O bank 1 |
| Pin 10 | I/O — User I/O bank 1 |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O bank 2 |
| Pin 13 | I/O — User I/O bank 2 |
| Pin 14 | I/O — User I/O bank 2 |
| Pin 15 | I/O — User I/O bank 2 |
| Pin 16 | I/O — User I/O bank 2 |
| Pin 17 | I/O — User I/O bank 2 |
| Pin 18 | I/O — User I/O bank 2 |
| Pin 19 | I/O — User I/O bank 2 |
| Pin 20 | I/O — User I/O bank 2 |
| Pin 21 | GND — Ground |
| Pin 22 | I/O — User I/O bank 2 |
| Pin 23 | I/O — User I/O bank 2 |
| Pin 24 | I/O — User I/O bank 2 |
| Pin 25 | I/O — User I/O bank 2 |
| Pin 26 | I/O — User I/O bank 2 |
| Pin 27 | I/O — User I/O bank 2 |
| Pin 28 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 29 | I/O — User I/O bank 1 |
| Pin 30 | TDI — JTAG Test Data In |
| Pin 31 | I/O — User I/O bank 1 |
| Pin 32 | I/O — User I/O bank 1 |
| Pin 33 | I/O — User I/O bank 1 |
| Pin 34 | I/O — User I/O bank 1 |
| Pin 35 | I/O — User I/O bank 1 |
| Pin 36 | I/O — User I/O bank 1 |
| Pin 37 | I/O — User I/O bank 1 |
| Pin 38 | I/O — User I/O bank 1 |
| Pin 39 | I/O — User I/O bank 1 |
| Pin 40 | TMS — JTAG Test Mode Select |
| Pin 41 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 42 | I/O — User I/O bank 1 |
| Pin 43 | I/O — User I/O bank 1 |
| Pin 44 | I/O — User I/O bank 1 |
| Pin 45 | I/O — User I/O bank 1 |
| Pin 46 | I/O — User I/O bank 1 |
| Pin 47 | I/O — User I/O bank 1 |
| Pin 48 | I/O — User I/O bank 1 |
| Pin 49 | I/O — User I/O bank 1 |
| Pin 50 | I/O — User I/O bank 1 |
| Pin 51 | TCK — JTAG Test Clock |
| Pin 52 | GND — Ground |
| Pin 53 | I/O — User I/O bank 3 |
| Pin 54 | I/O — User I/O bank 3 |
| Pin 55 | I/O — User I/O bank 3 |
| Pin 56 | I/O — User I/O bank 3 |
| Pin 57 | I/O — User I/O bank 3 |
| Pin 58 | I/O — User I/O bank 3 |
| Pin 59 | I/O — User I/O bank 3 |
| Pin 60 | I/O — User I/O bank 3 |
| Pin 61 | I/O — User I/O bank 3 |
| Pin 62 | I/O — User I/O bank 3 |
| Pin 63 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 64 | I/O — User I/O bank 3 |
| Pin 65 | I/O — User I/O bank 3 |
| Pin 66 | I/O — User I/O bank 3 |
| Pin 67 | I/O — User I/O bank 3 |
| Pin 68 | I/O — User I/O bank 3 |
| Pin 69 | I/O — User I/O bank 3 |
| Pin 70 | I/O — User I/O bank 3 |
| Pin 71 | I/O — User I/O bank 3 |
| Pin 72 | TDO — JTAG Test Data Out |
| Pin 73 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 74 | I/O — User I/O bank 3 |
| Pin 75 | I/O — User I/O bank 3 |
| Pin 76 | I/O — User I/O bank 3 |
| Pin 77 | I/O — User I/O bank 3 |
| Pin 78 | I/O — User I/O bank 3 |
| Pin 79 | I/O — User I/O bank 3 |
| Pin 80 | I/O — User I/O bank 3 |
| Pin 81 | I/O — User I/O bank 3 |
| Pin 82 | I/O — User I/O bank 3 |
| Pin 83 | GND — Ground |
| Pin 84 | I/O — User I/O bank 4 |
| Pin 85 | I/O — User I/O bank 4 |
| Pin 86 | I/O — User I/O bank 4 |
| Pin 87 | I/O — User I/O bank 4 |
| Pin 88 | I/O — User I/O bank 4 |
| Pin 89 | I/O — User I/O bank 4 |
| Pin 90 | I/O — User I/O bank 4 |
| Pin 91 | I/O — User I/O bank 4 |
| Pin 92 | I/O — User I/O bank 4 |
| Pin 93 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 94 | I/O — User I/O bank 4 |
| Pin 95 | I/O — User I/O bank 4 |
| Pin 96 | I/O — User I/O bank 4 |
| Pin 97 | I/O — User I/O bank 4 |
| Pin 98 | I/O — User I/O bank 4 |
| Pin 99 | I/O — User I/O bank 4 |
| Pin 100 | I/O — User I/O bank 4 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570T100C4N is suitable for 6 applications: Industrial I/O Expansion and Bus Bridging, Power Sequencing and Supervisory Logic, Networking and Telecom Backplane Glue Logic, Motor Control and LED Driving Interfaces, Legacy 5V CPLD Replacement, Automotive Cluster and Building Automation Logic.
Industrial I/O Expansion and Bus Bridging
The EPM570T100C4N fits industrial I/O expansion boards because its 76 user I/Os in a 100-TQFP package, 5.4 ns pin-to-pin delay, and MultiVolt 1.5/1.8/2.5/3.3 V banks let one device bridge legacy 5V-tolerant logic, 3.3 V microcontrollers, and 1.8 V FPGAs on the same PCB. Designers typically instantiate it as an address-latch, level shifter, or parallel-to-SPI converter sitting between a host MCU and a downstream ASIC. The non-volatile flash configuration eliminates boot-PROM overhead and lets the CPLD drive enable lines within microseconds of power-up - critical for deterministic industrial control loops. Compared with a small FPGA, the MAX II gives instant-on behavior and lower quiescent cost for glue-logic density in this class.
Recommended
Power Sequencing and Supervisory Logic
The EPM570T100C4N is widely used in power-sequencing and supervisory logic for ATX-style and telecom boards because its 440 macrocells and 0.4 ns granularity combinational paths let designers implement multi-rail sequencers, watchdog timers, and reset-orchestration state machines on 76 I/Os. Its 5.4 ns tpd plus 247.5 MHz fMAX guarantee sub-microsecond response to PG (power-good) edges, and the instant-on flash boot means rails are sequenced without boot-PROM delay. Typical usage places the CPLD between a supervisor IC and the load-switch FETs, generating delayed enable pulses and ORing fault signals into a single PCH-compatible reset. Compared with discrete sequencer ICs, the EPM570T100C4N offers re-programmable sequencing graphs.
Recommended
Networking and Telecom Backplane Glue Logic
In telecom backplanes the EPM570T100C4N acts as a mid-density glue-logic hub, decoding address lines, generating chip-selects for SRAM/Flash banks, and converting between LVCMOS and HSTL interfaces on the same die. Its 76 MultiVolt I/Os let it sit directly on 1.8 V FPGA transceivers and 3.3 V PHY devices without external level shifters, while 440 macrocells are enough to map 16-bit address-decoding trees and 4-channel FIFO flag logic. The 5.4 ns tpd plus 247.5 MHz fMAX meet the hold-time budgets of Fast Ethernet and PCIe Gen1 sideband signals. Compared with a discrete 74AVC/74LVC logic forest, one EPM570T100C4N replaces 30+ buffers in the same board area.
Recommended
Motor Control and LED Driving Interfaces
Motor-control and LED-driving front-ends use the EPM570T100C4N as a flexible PWM generator and fault aggregator, leveraging its 76 user I/Os to drive multiple half-bridge drivers, encode Hall-sensor inputs, and arbitrate hardware protection signals in real time. The 247.5 MHz internal frequency supports PWM resolutions down to ~8 ns at 100 kHz switching, and the 5.4 ns tpd ensures sub-microsecond response to overcurrent comparator trips. Its MultiVolt I/O banks accept 3.3 V MCU outputs and 5 V gate-driver feedback without level shifters, and the flash-based boot means the motor controller is ready within microseconds of DC-bus connection - essential for safe soft-start of PMSM and BLDC drives.
Recommended
Legacy 5V CPLD Replacement
The EPM570T100C4N is a popular drop-in for legacy 5V CPLDs (such as Altera MAX 7000 and Xilinx XC9500 designs) because it delivers equivalent macrocell density at lower power and adds 1.5/1.8/2.5/3.3 V MultiVolt I/O compatibility for modern system designs. With 440 macrocells, 76 I/Os, and 5.4 ns tpd it covers the bulk of legacy state-machine, decoder, and bus-interface designs while shrinking board area and removing the external 5V regulator. Designs can be migrated using the Quartus II 'MAX 7000 to MAX II' project wizard with full pinout preservation in the 100-TQFP footprint. Compared with maintaining an obsolete 5V CPLD on a BOM, the EPM570T100C4N improves lifecycle and EMI simultaneously.
Recommended
Automotive Cluster and Building Automation Logic
In automotive instrument clusters and building-automation controllers, the EPM570T100C4N serves as deterministic glue logic between microcontrollers, display drivers, CAN transceivers, and sensor front-ends. Its instant-on flash configuration makes outputs settle within microseconds of battery connection - critical for safety indicators that must illuminate at crank. The 76 MultiVolt I/Os interface seamlessly with 3.3 V MCUs and 5 V sensor networks, and 440 macrocells are enough to encode CAN-to-LIN gateways, HVAC mode logic, and gauge-stepper waveforms. Designers choose the commercial 0-85 °C variant for cabin modules and migrate to EPM570T100I5N for under-hood locations, all within the same 100-TQFP footprint.
Recommended
Recommended Products Summary
Engineering reference data for EPM570T100C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570T100C5N | EPM570T100C3N | EPM570T100I5N | EPM570GT100C5N | EPM570GT100C4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel (MAX II G) | Intel (MAX II G) |
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/O | 76 | 76 | 76 | 76 | 76 | 76 |
| tpd (pin-to-pin) | 5.4 ns | 5.0 ns (faster) | 6.5 ns (slower) | 5.0 ns (faster, industrial) | 5.0 ns | 5.4 ns |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | -40 °C to 100 °C (industrial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) |
| Core Supply | Internal 1.8 V regulator (single 3.3 V in) | Internal regulator (same) | Internal regulator (same) | Internal regulator (same) | External 1.8 V required | External 1.8 V required |
| Configuration Memory | Internal flash (instant-on) | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash |
Key Differentiators
- Instant-on non-volatile flash configuration eliminates boot PROM (vs SRAM-based CPLDs/FPGAs)
- MultiVolt I/O banks interface directly to 1.5/1.8/2.5/3.3 V logic on the same die (vs Legacy 5V-only CPLDs (e.g. MAX 7000))
- Pin-to-pin compatibility across speed grades (C3N/C4N/C5N) and temperature grades (C/I) in the same 100-TQFP footprint (vs EPM570 in different packages (e.g. BGA-256))
Design Notes
The EPM570T100C4N integrates an internal 1.8 V core regulator that operates from a single 3.3 V VCCINT supply. Place one 0.1 µF ceramic decoupling cap within 5 mm of every VCCINT pin and one bulk 10 µF tantalum or ceramic cap near the package; do NOT connect an external 1.8 V rail to VCCINT, as this will back-drive the internal LDO and may damage the device. The MultiVolt VCCIO banks (1.5/1.8/2.5/3.3 V) must each have their own 0.1 µF + 1 µF decoupling pair because they power the I/O drivers directly. Estimated: at 247.5 MHz internal toggle and all 76 I/Os at 25 pF/10 MHz, the device draws approximately 30-50 mA from VCCINT - confirm with the Quartus II PowerPlay analyzer for your design.
Use a four-layer PCB with a continuous ground plane beneath the 100-TQFP footprint; split power planes are acceptable only if the 3.3 V and VCCIO islands do not cross high-di/dt return paths. JTAG signals (TCK/TMS/TDO/TDI) should be routed with 50 Ω characteristic impedance and pulled up to VCCIO1 through 10 kΩ resistors per the MAX II handbook recommendation; missing pull-ups are the single most common cause of ByteBlaster II programming failures. Keep TCK trace length under 75 mm to maintain signal integrity at the 10 MHz default JTAG clock. Thermal performance of the 100-TQFP at full 76-I/O 25 MHz LVCMOS toggle is typically a 15-20 °C junction rise, so no heatsink is required for commercial-temperature designs.
Three pitfalls appear repeatedly in EPM570T100C4N designs: (1) leaving JTAG pins floating - this causes intermittent ISP failures; always add 10 kΩ pull-ups to VCCIO1 on TCK, TMS, TDI, and TRST if exposed. (2) Driving VCCIO before VCCINT during power-up sequencing - the MAX II tolerates any order, but mixed-voltage ramps can momentarily enable I/O during core reset; insert a 1 ms RC delay on VCCIO if your upstream regulator has soft-start. (3) Confusing MAX II (internal regulator) with MAX II G (external 1.8 V core) - a MAX II G device will not program if VCCINT is left at 3.3 V. Always verify the device marking before PCB bring-up.
Compliance Information
RoHS and lead-free compliance confirmed via Altera/Intel product environmental certification documents. REACH status per EU distributor declarations. AEC-Q100 is not applicable to CPLDs of this class; for automotive applications use the AEC-Q100-qualified MAX V or Cyclone families instead.
