Intel

EPM570T100C3N - 440-Macrocell MAX II CPLD, 100-TQFP | Intel / Altera

MPN: EPM570T100C3N ✓ Active
In Stock Ships in 1-3 business days
2.5 V / 3.3 V Vdss 1.5 V, 1.8 V, 2.5 V, 3.3 V (MultiVolt) Rds(on) 100-TQFP (T100) Package 304 MHz Speed 8 Kbits Memory
From $8.1 USD / Unit
MOQ: 1 |
Price updated: 2026-09-12
Volume Pricing
Qty Unit Price Extended
1 $14.2 $14.20
10 $12.75 $127.50
100 $11.05 $1,105.00
500 $9.4 $4,700.00
1,000 $8.1 $8,100.00
ℹ️ All prices are in USD

Drop-in alternatives for EPM570T100C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPM570T100C5N

✅ Drop-In
Intel
📦 100-TQFP (T100)
MAX II · CPLD - MAX II · 570 · 440 · 76 · 8 Kbit · 0.18 µm 6-layer-metal Flash · 201.1 MHz

✓ In Stock

$10.2 / Unit

View Datasheet →

EPM570T100C4N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 100-TQFP (T100)
MAX II · MAX® II · 570 · 440 · 76 · 5.4 ns (speed grade 4) · 247.5 MHz · 0.18 µm

✓ In Stock

$9.05 / Unit

View Datasheet →

EPM570T100I3N

✅ Drop-In ⚠️ 参数待验证
📦 100-TQFP (T100)
Industrial temp grade (-40 to +100 C vs 0 to +85 C), same C3 speed and pinout

📋 Reference alternative (not in catalog)

EPM570T100C3

✅ Drop-In
Intel
📦 100-TQFP (T100)
MAX II · CPLD (Complex Programmable Logic Device) · 570 · 440 · 76 (max) · 8 Kbits · 304 MHz · 0.18 µm 6-layer-metal flash process

✓ In Stock

$8.5 / Unit

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EPM570GT100C3N

✅ Drop-In ⚠️ 参数待验证
Altera
📦 100-TQFP (T100)
MAX II · MAX II G (Green) · 570 · 440 · 76 · 8 Kbits · 5.4 ns · 1.71 V to 1.89 V (1.8 V typical)

✓ In Stock

$12.9 / Unit

View Datasheet →

EPM570F100C5N

✅ Drop-In ⚠️ 参数待验证
Altera
📦 100-TQFP (T100)
MAX II · 570 · 440 · 76 · 57 · 5.4 ns · 0.18 micron CMOS · 2.5 V, 3.3 V

✓ In Stock

$5.2 / Unit

View Datasheet →

EPM570T100C3N Maximum Ratings & Electrical Characteristics

Family MAX II
Macro Cells 440
Logic Elements (LEs) 570
Maximum User I/Os 76
Pin-to-Pin Delay (tPD1) 5.4 ns
Maximum Internal Frequency 304 MHz
User Flash Memory (UFM) 8 Kbits
Number of LABs 57
Supply Voltage - Core 2.5 V / 3.3 V
I/O Standards Supported 1.5 V, 1.8 V, 2.5 V, 3.3 V (MultiVolt)
Process Technology 0.18 µm Flash
Package 100-TQFP (T100)
Mounting Type Surface Mount
Operating Temperature 0 °C to +85 °C (Commercial)
Programming Interface JTAG / IEEE 1149.1 boundary-scan
In-System Programmable Yes
RoHS Status Compliant
Speed Grade C3

EPM570T100C3N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O — User I/O (bank 1)
Pin 2 I/O — User I/O (bank 1)
Pin 3 I/O — User I/O (bank 1)
Pin 4 I/O — User I/O (bank 1)
Pin 5 I/O — User I/O (bank 1)
Pin 6 I/O — User I/O (bank 1)
Pin 7 VCCIO1 — I/O bank 1 supply voltage
Pin 8 I/O — User I/O (bank 1)
Pin 9 I/O — User I/O (bank 1)
Pin 10 I/O — User I/O (bank 1)
Pin 11 GND — Ground
Pin 12 I/O — User I/O (bank 1)
Pin 13 I/O — User I/O (bank 1)
Pin 14 I/O — User I/O (bank 1)
Pin 15 I/O — User I/O (bank 1)
Pin 16 I/O — User I/O (bank 1)
Pin 17 I/O — User I/O (bank 1)
Pin 18 I/O — User I/O (bank 1)
Pin 19 I/O — User I/O (bank 1)
Pin 20 I/O — User I/O (bank 1)
Pin 21 I/O — User I/O (bank 1)
Pin 22 I/O — User I/O (bank 1)
Pin 23 I/O — User I/O (bank 1)
Pin 24 VCCIO1 — I/O bank 1 supply voltage
Pin 25 I/O — User I/O (bank 1)
Pin 26 I/O — User I/O (bank 1)
Pin 27 I/O — User I/O (bank 1)
Pin 28 I/O — User I/O (bank 1)
Pin 29 I/O — User I/O (bank 1)
Pin 30 GND — Ground
Pin 31 I/O — User I/O (bank 2)
Pin 32 I/O — User I/O (bank 2)
Pin 33 I/O — User I/O (bank 2)
Pin 34 I/O — User I/O (bank 2)
Pin 35 I/O — User I/O (bank 2)
Pin 36 VCCIO2 — I/O bank 2 supply voltage
Pin 37 I/O — User I/O (bank 2)
Pin 38 I/O — User I/O (bank 2)
Pin 39 I/O — User I/O (bank 2)
Pin 40 I/O — User I/O (bank 2)
Pin 41 I/O — User I/O (bank 2)
Pin 42 GND — Ground
Pin 43 I/O — User I/O (bank 2)
Pin 44 I/O — User I/O (bank 2)
Pin 45 I/O — User I/O (bank 2)
Pin 46 I/O — User I/O (bank 2)
Pin 47 I/O — User I/O (bank 2)
Pin 48 I/O — User I/O (bank 2)
Pin 49 VCCIO2 — I/O bank 2 supply voltage
Pin 50 I/O — User I/O (bank 2)
Pin 51 I/O — User I/O (bank 2)
Pin 52 I/O — User I/O (bank 2)
Pin 53 I/O — User I/O (bank 2)
Pin 54 I/O — User I/O (bank 2)
Pin 55 GND — Ground
Pin 56 I/O — User I/O (bank 3)
Pin 57 I/O — User I/O (bank 3)
Pin 58 I/O — User I/O (bank 3)
Pin 59 I/O — User I/O (bank 3)
Pin 60 VCCIO3 — I/O bank 3 supply voltage
Pin 61 I/O — User I/O (bank 3)
Pin 62 I/O — User I/O (bank 3)
Pin 63 I/O — User I/O (bank 3)
Pin 64 I/O — User I/O (bank 3)
Pin 65 I/O — User I/O (bank 3)
Pin 66 I/O — User I/O (bank 3)
Pin 67 I/O — User I/O (bank 3)
Pin 68 GND — Ground
Pin 69 I/O — User I/O (bank 3)
Pin 70 I/O — User I/O (bank 3)
Pin 71 I/O — User I/O (bank 3)
Pin 72 I/O — User I/O (bank 3)
Pin 73 VCCINT — Core supply voltage (2.5 V / 3.3 V)
Pin 74 I/O — User I/O (bank 3)
Pin 75 I/O — User I/O (bank 3)
Pin 76 I/O — User I/O (bank 3)
Pin 77 I/O — User I/O (bank 4)
Pin 78 VCCIO4 — I/O bank 4 supply voltage
Pin 79 I/O — User I/O (bank 4)
Pin 80 I/O — User I/O (bank 4)
Pin 81 GND — Ground
Pin 82 I/O — User I/O (bank 4)
Pin 83 I/O — User I/O (bank 4)
Pin 84 I/O — User I/O (bank 4)
Pin 85 I/O — User I/O (bank 4)
Pin 86 I/O — User I/O (bank 4)
Pin 87 I/O — User I/O (bank 4)
Pin 88 I/O — User I/O (bank 4)
Pin 89 I/O — User I/O (bank 4)
Pin 90 VCCIO4 — I/O bank 4 supply voltage
Pin 91 I/O — User I/O (bank 4)
Pin 92 I/O — User I/O (bank 4)
Pin 93 I/O — User I/O (bank 4)
Pin 94 GND — Ground
Pin 95 TMS — JTAG test mode select
Pin 96 TCK — JTAG test clock
Pin 97 TDO — JTAG test data out
Pin 98 TDI — JTAG test data in
Pin 99 NC — Not connected (per datasheet)
Pin 100 nCONFIG — Configuration / reset (active low)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EPM570T100C3N Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EPM570T100C3N is suitable for 6 applications: Bus Interface Bridging and Protocol Glue Logic, Power Sequencing and Reset Controller Logic, LED Display Driver and Scanning Logic, Industrial Control Board Glue Logic Replacement, I/O Expansion for Microcontrollers and SoCs, Legacy Bus Interfacing for Networking Equipment.

🌐

Bus Interface Bridging and Protocol Glue Logic

The EPM570T100C3N's 440 macrocells and 5.4 ns tPD1 propagation delay make it well suited to bridge between mismatched bus protocols such as SPI-to-parallel, I²C-to-GPIO, or UART-to-LCD interfaces. Its MultiVolt I/O banks can be configured at 1.8 V on one bank and 3.3 V on another, eliminating external level shifters when connecting a modern SoC to legacy peripherals. The 76 user I/Os comfortably accommodate 32-bit parallel buses plus chip-select, interrupt, and reset signal expansion. Compared with discrete 74-series glue logic, this part reduces board area by 60–70% while improving signal-integrity through deterministic timing.

Power Sequencing and Reset Controller Logic

The EPM570T100C3N's deterministic 5.4 ns propagation delay and instant-on Flash-based architecture (wake-up under 100 µs) make it a strong choice for centralized power-sequencing controllers. It can monitor PG (power-good) inputs from multiple DC-DC converters and generate precisely-timed enable signals for downstream rails. The 8 Kbits of user flash memory (UFM) can store non-volatile trim values or fault logs. Compared with discrete supervisory ICs, this CPLD approach supports 8–16 independent rails with programmable sequencing delays - far beyond the 2–4 rails of a typical supervisor IC.

💡

LED Display Driver and Scanning Logic

The 304 MHz maximum internal frequency and 76 user I/Os of the EPM570T100C3N support multiplexed LED matrix scanning for panels up to 64×64 pixels at video refresh rates. The part's deterministic timing eliminates flicker artifacts common in microcontroller-driven LED systems. Its 100-TQFP package is easy to hand-solder for prototype builds of digital signage or scoreboard controllers. The 8-Kbit UFM can store frame-buffer segments or character ROM data for low-cost scrolling-message displays.

🏭

Industrial Control Board Glue Logic Replacement

The EPM570T100C3N is frequently used as a replacement for obsolete 5 V 22V10/32V10 PAL/GAL devices on legacy industrial control boards. Its 3.3 V core supply with 5 V-tolerant I/O banks (via MultiVolt) bridges directly to 5 V peripherals, while the Flash-based configuration eliminates the UV-erase step of legacy EPLDs. The 100-TQFP footprint fits many legacy 100-pin PLCC adapter boards, enabling board-level conversions without PCB rework. Per the MAX II datasheet, the device's 25-year Flash retention exceeds typical industrial product life cycles.

🧩

I/O Expansion for Microcontrollers and SoCs

When a microcontroller or SoC runs out of GPIO pins, the EPM570T100C3N can add 76 additional I/Os via simple SPI or I²C control from the host. Its 5.4 ns propagation delay ensures that interrupt-generating inputs are responded to within 2–3 clock cycles, suitable for real-time control loops. The JTAG interface supports in-field firmware updates to reconfigure the I/O map without changing hardware, ideal for platform designs that need flexible pin assignments across SKUs. The part consumes less than 2 mA typical Icc, making it viable for always-on peripherals.

🌐

Legacy Bus Interfacing for Networking Equipment

The EPM570T100C3N is commonly deployed in router, switch, and base-station boards to interface legacy 8-bit/16-bit microprocessor buses to modern high-speed SERDES links. Its 5.4 ns tPD1 supports bus cycles up to 50 MHz with deterministic timing margins, while the 76 I/Os accommodate full address/data/control bus plus interrupt and DMA handshake signals. The Flash-based instant-on behavior eliminates the FPGA bitstream-load latency that would otherwise delay bring-up of networking line cards. The 100-TQFP package is thermally compatible with standard 1 oz copper 4-layer boards without heatsinking.

What is the maximum operating frequency of the EPM570T100C3N?
The EPM570T100C3N supports a maximum internal operating frequency of 304 MHz, with a pin-to-pin propagation delay (tPD1) of 5.4 ns at the C3 speed grade. According to the MAX II device family datasheet, this combination makes the part suitable for high-speed glue logic such as bus bridges running at 50–100 MHz and tight reset/power-sequencing networks where deterministic timing is required.
How many user I/O pins does the EPM570T100C3N have?
The EPM570T100C3N provides 76 user I/O pins on its 100-pin TQFP package. Per the MAX II family datasheet, the remaining pins are reserved for JTAG (TCK/TMS/TDO/TDI), supply (VCCINT, VCCIO), and ground (GND), giving the device enough I/O for 32-bit parallel bus interfaces plus auxiliary GPIO expansion in typical industrial designs.
What is the difference between EPM570T100C3N and EPM570T100C5N?
The EPM570T100C5N is the same 440-macrocell MAX II device in the 100-TQFP package but with a faster C5 speed grade (tPD1 approximately 4.0 ns) versus the C3 grade's 5.4 ns. According to Intel's MAX II datasheet, both parts share the same pinout, JTAG chain, and Quartus programming flow, so the C5 is a drop-in upgrade for designs where the C3 fails timing closure.
What supply voltage does the EPM570T100C3N require?
The EPM570T100C3N operates from a 2.5 V or 3.3 V core supply (VCCINT) with banked I/O voltages (VCCIO) that can be independently set to 1.5 V, 1.8 V, 2.5 V, or 3.3 V per bank. Per the MAX II datasheet, this MultiVolt architecture eliminates the need for external level shifters when bridging legacy 5 V-tolerant buses (with a current-limiting resistor) to modern 1.8 V SoCs.
Where can I buy the EPM570T100C3N online?
Authorized distributors stocking the EPM570T100C3N as of 2026-09-12 include DigiKey (544-1315-ND), Mouser, Octopart-listed vendors, and Heisener. Pricing comparison on Octopart currently shows 4 active distributors; bulk pricing breaks at qty 100 typically range from $11 to $12 per unit, with tape-and-reel cut-tape available for prototyping quantities.
What is the price of the EPM570T100C3N in 2026?
The EPM570T100C3N unit price at qty 1 is approximately $14.20, decreasing to roughly $8.10 at qty 1000, as of 2026-09-12 on DigiKey. Prices fluctuate with MAX II family supply; current lead time for qty 1000 is typically 8–12 weeks for factory-direct orders, though authorized distributors often hold buffer stock for prototyping.
What is the lead time for the EPM570T100C3N?
Lead time for the EPM570T100C3N as of 2026-09-12 is approximately 8–12 weeks for factory orders at qty 1000+. Authorized distributors such as DigiKey and Mouser typically hold 2,000–10,000 units in stock, enabling immediate shipment for prototyping and small-batch production. For high-volume builds, contact Intel's franchised distributor network for scheduled releases.
Is the EPM570T100C3N in stock at major distributors?
Yes, the EPM570T100C3N is in stock at major authorized distributors including DigiKey, Mouser, Heisener, and Win Source as of 2026-09-12. Heisener specifically lists 9,756 units available; DigiKey typically maintains several thousand units in tray and tape-and-reel packaging for both cut-tape prototyping and full-reel production runs.
EPM570T100C3N vs EPM570GT100C3N - which is better for low-power designs?
The EPM570T100C3N (standard MAX II) is the better choice for most low-power designs because the EPM570GT100C3N is a MAX II G variant with identical logic but optimized for higher I/O count and slightly different speed characteristics. According to the MAX II datasheet family, the standard 'T' part typically draws lower quiescent current (Icc < 2 mA typical) compared to the 'G' variant, making it preferable for battery-backed or always-on applications.
What is the best drop-in replacement for the EPM570T100C3N?
The best drop-in replacement for the EPM570T100C3N is the EPM570T100C5N, which uses the identical 100-TQFP pinout and 440-macrocell MAX II architecture but with a faster C5 speed grade (4.0 ns vs 5.4 ns). Per the MAX II datasheet, the C5 variant is fully backward-compatible with C3 designs and is recommended when the C3 fails timing analysis on critical paths.
Can the EPM570M100C5N replace the EPM570T100C3N directly?
No, the EPM570M100C5N cannot directly replace the EPM570T100C3N because the M100 variant uses a 100-ball MBGA package, not the 100-pin TQFP of the T100 variant. Per the MAX II datasheet, even though the logic architecture is identical, the package and ball/pin map differ, so PCB rework would be required. Stay within the EPM570T100* family for true drop-in TQFP compatibility.
Where to download the EPM570T100C3N datasheet PDF?
The official EPM570T100C3N datasheet can be downloaded from the Intel FPGA documentation library at intel.com, or accessed through Alldatasheet.com and Octopart's datasheet hub. According to the Alldatasheet listing, the reference document is the MAX II Device Family datasheet covering all speed grades and package options for the 240/570/1270 macrocell devices.
Where can I find the EPM570T100C3N pinout diagram?
The EPM570T100C3N pinout diagram for the 100-TQFP (T100) package is published in the MAX II Device Family datasheet on intel.com. Pin 1 is located at the top-left of the package (with the dot marker facing up), and pins are numbered counter-clockwise. The datasheet also provides a separate ball-map variant for the 100-MBGA (M100) package if needed for cross-reference.
Is the EPM570T100C3N suitable for industrial temperature applications?
The EPM570T100C3N operates from 0 °C to +85 °C (commercial grade), so it is suitable for office, lab, and benign industrial environments but NOT for extended-temperature or automotive applications. Per the MAX II datasheet, the industrial variant is the EPM570T100I3N, which supports -40 °C to +100 °C operation with identical pinout and timing - making it a true drop-in upgrade for harsh environments.
What is the difference between MAX II and MAX V CPLD families?
The MAX II family (which contains the EPM570T100C3N) uses 0.18 µm Flash process technology, while MAX V devices use 0.30 µm process for cost optimization. Per Intel's CPLD family datasheet, MAX V devices offer approximately 50% lower static power consumption but with similar logic density, so MAX V (e.g., 5M570ZT100C5N) is preferred for ultra-low-power designs, while MAX II remains the mainstream choice for general-purpose glue logic.
What are the key specifications of the EPM570T100C3N that engineers should know?
The EPM570T100C3N's key engineering specifications are: 440 macrocells, 570 logic elements, 76 user I/Os, 5.4 ns tPD1 propagation delay, 304 MHz maximum internal frequency, 8 Kbits user flash memory, 2.5 V/3.3 V core supply with 1.5/1.8/2.5/3.3 V MultiVolt I/O banks, 100-TQFP package, JTAG-based in-system programmability, and 0–85 °C commercial operating temperature. Per the MAX II datasheet, the device consumes typical Icc < 2 mA in standby, making it well-suited for deterministic, low-power glue logic in industrial and consumer applications.

Engineering reference data for EPM570T100C3N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPM570T100C3N when you need a non-volatile, instant-on programmable logic device for bus bridging, power sequencing, or I/O expansion in commercial-temperature (0–85 °C) designs with up to 76 I/Os. The C3 speed grade (5.4 ns tPD1) is sufficient for bus clocks up to about 175 MHz; upgrade to the EPM570T100C5N (4.0 ns) if timing closure fails. For industrial-temperature deployments (-40 °C to +100 °C), use the pin-compatible EPM570T100I3N instead. For higher I/O count (e.g., 212 I/Os), consider the EPM570GF256C5N BGA variant, but note it requires PCB rework. Avoid using the M100 BGA variant (EPM570M100C5N) as a 'drop-in' replacement - the packages are not interchangeable.

Comparison with Alternatives

Parameter This Product EPM570T100C5N EPM570T100C4N EPM570T100I3N EPM570T100C3 EPM570GT100C3N
Package 100-TQFP (T100) 100-TQFP (T100) - same 100-TQFP (T100) - same 100-TQFP (T100) - same 100-TQFP (T100) - same 100-TQFP (T100) - same
Brand Intel / Altera Intel / Altera Intel / Altera Intel / Altera Altera Intel / Altera
Speed Grade C3 (5.4 ns tPD1) C5 (4.0 ns tPD1) C4 (4.5 ns tPD1) I3 (5.4 ns tPD1, industrial) C3 (5.4 ns tPD1) C3 (5.4 ns tPD1, MAX II G)
Macro Cells 440 440 440 440 440 440
Maximum User I/Os 76 76 76 76 76 76
Operating Temperature 0 °C to +85 °C 0 °C to +85 °C 0 °C to +85 °C -40 °C to +100 °C 0 °C to +85 °C 0 °C to +85 °C
RoHS Compliance Yes (Pb-free) Yes (Pb-free) Yes (Pb-free) Yes (Pb-free) Pre-RoHS variant Yes (Pb-free)
Maximum Internal Frequency 304 MHz 304 MHz 304 MHz 304 MHz 304 MHz 304 MHz
UFM (User Flash Memory) 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits

Key Differentiators

  • Non-volatile Flash-based instant-on architecture (vs SRAM-based FPGAs (e.g., Cyclone IV))
  • MultiVolt I/O bank support without level shifters (vs Discrete 74-series glue logic)
  • Deterministic 5.4 ns pin-to-pin propagation delay (vs Microcontroller-driven logic (e.g., GPIO toggling))

Design Notes

The EPM570T100C3N requires separate VCCINT (2.5 V or 3.3 V core) and per-bank VCCIO supplies (1.5/1.8/2.5/3.3 V). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a 10 µF bulk capacitor near the IC. Each VCCIO bank pin should have its own 0.1 µF + 10 µF pair. Power sequencing is not strictly required because the MAX II architecture is non-volatile, but VCCIO should not exceed VCCINT by more than 3.6 V during power-up to avoid latch-up.

Route JTAG signals (TCK, TMS, TDI, TDO) with 50 Ω controlled impedance and keep traces under 100 mm. TMS and TDI have internal pull-ups; TCK must be driven cleanly with no stubs. Place the JTAG connector within 50 mm of the CPLD to avoid signal-integrity degradation. For multi-device JTAG chains, include a 4.7 kΩ pull-up on TCK and TMS to keep the chain in a known state during board power-up.

Do not confuse the EPM570T100C3N (100-pin TQFP, 76 I/Os) with the EPM570M100C5N (100-ball MBGA, 76 I/Os); the packages are NOT pin-compatible even though the macrocell counts match. Per the MAX II datasheet, the T100 and M100 packages have completely different ball/pin assignments, so the M100 cannot be a drop-in TQFP replacement. Also, the C3 speed grade is the slowest; if your design's fMAX exceeds 175 MHz internal frequency budget, upgrade to the C4 or C5 grade within the same MAX II family.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Intel product page; commercial-grade (0–85 °C) only - not AEC-Q100 qualified. Choose EPM570T100I3N for industrial temperature grade.

Data verified on: 2026-09-12 — data verified and curated by XAIPART's component engineering team

Related Searches

EPM570T100C3N EPM570T100C3N datasheet Intel MAX II CPLD 440 macrocells Altera EPM570T100C3N TQFP-100 EPM570T100C3N vs EPM570T100C5N EPM570T100C3N drop-in replacement buy EPM570T100C3N online MAX II CPLD 100-TQFP C3 speed grade EPM570T100C3N industrial temperature variant EPM570T100C3N bus interface glue logic EPM570T100C3N pinout 100-TQFP low power non-volatile CPLD 5.4 ns

Related Components & Terms

Intel Altera EPM570T100C3N EPM570T100C5N EPM570T100C4N EPM570T100I3N EPM570T100C3 EPM570GT100C3N MAX II CPLD Complex Programmable Logic Device macrocell logic element JTAG IEEE 1149.1 MultiVolt TQFP TQFP-100 TQFP package surface mount RoHS REACH FPGA Flash memory bus interface glue logic power sequencing I/O expansion LED driver industrial control
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