H5AN8G6NCJR-XXC vs K4B4G1646D-BYK00 Comparison

Detailed side-by-side comparison of H5AN8G6NCJR-xxC by SK hynix and K4B4G1646D-BYK00 by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5AN8G6NCJR-xxC H5AN8G6NCJR-xxC - 8Gb DDR4 SDRAM 2666Mbps | SK Hynix

H5AN8G6NCJR-xxC - 8Gb DDR4 SDRAM 2666Mbps | SK Hynix

H5AN8G6NCJR-xxC ✓ Active
Samsung Electronics
K4B4G1646D-BYK00 K4B4G1646D-BYK00 - 4Gb DDR3L SDRAM 256Mx16 96FBGA | Samsung

K4B4G1646D-BYK00 - 4Gb DDR3L SDRAM 256Mx16 96FBGA | Samsung

K4B4G1646D-BYK00 ✓ Active

Specification Comparison

Parameter H5AN8G6NCJR-xxC K4B4G1646D-BYK00
Brand SK hynix Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $6.50 $7.50
Memory Type DDR4 SDRAM DDR3L SDRAM
Density 8 Gb 4 Gb
Organization 512M x 16 256M x 16
Data Rate 2666 Mbps (VKC speed grade) 1600 Mbps
Supply Voltage (VDD) 1.2 V —
VPP Supply 2.5 V —
Operating Temperature (TC) 0°C to 95°C —
Package 96-ball FBGA 96-ball TFBGA
Number of Banks 8 —
Burst Length 8, 4 (with burst chop) —
On-Die Termination (ODT) Supported —
Self-Refresh Temperature-compensated (TCSR) —
RoHS Compliant Compliant
Lead-Free Yes Yes
Mounting Type Surface Mount —
Supply Voltage — 1.35 V (also operates at 1.5 V)
Number of Terminals — 96
Operating Temperature — 0°C to 85°C
CAS Latency — Programmable
Additional Features — Auto precharge, asynchronous reset, ZQ calibration, data mask, dynamic on-chip termination
Halogen Free — Yes
Package Shape — RECTANGULAR
Temperature Grade — OTHER

Datasheets & Resources

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