H5TC4G63AFR-PBJ vs MT41K256M16RE-125:D Comparison

Detailed side-by-side comparison of H5TC4G63AFR-PBJ by SK hynix and MT41K256M16RE-125:D by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5TC4G63AFR-PBJ H5TC4G63AFR-PBJ - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix

H5TC4G63AFR-PBJ - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix

H5TC4G63AFR-PBJ ✓ Active
Micron Technology
MT41K256M16RE-125:D MT41K256M16RE-125:D - 4Gb DDR3L SDRAM 256Mx16 | Micron

MT41K256M16RE-125:D - 4Gb DDR3L SDRAM 256Mx16 | Micron

MT41K256M16RE-125:D ✓ Active

Specification Comparison

Parameter H5TC4G63AFR-PBJ MT41K256M16RE-125:D
Brand SK hynix Micron Technology
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $7.50 $4.19
Memory Type DDR3L SDRAM DDR3L SDRAM
Memory Size 4 Gb (256M x 16) —
Supply Voltage 1.35 V 1.35 V
Package 96-ball TFBGA FBGA-96 (9x14 mm)
Temperature Grade Industrial (-40°C to +95°C) —
Refresh Cycles 8192 —
Package Shape Rectangular —
Number of Terminals 96 —
Data Rate [DATA_NEEDED: Data rate (e.g., 1600 Mbps)] 1600 MT/s
CAS Latency [DATA_NEEDED: CAS Latency] 11
Access Time 0.225 ns (from H5TC4G63AFR-PBR datasheet) —
Auto Self-Refresh Yes —
Data Mask Yes —
Auto Precharge Yes —
Asynchronous Reset Yes —
Dynamic On-Chip Termination Yes —
ZQ Calibration Yes —
Write Leveling Yes —
RoHS Status [DATA_NEEDED: RoHS Status] —
Density — 4 Gb
Organization — 256M x 16
Operating Temperature — 0C to +95C (TC)
RoHS — Compliant
Lead-Free — Yes
Burst Length — 8, 4
On-Die Termination — Yes
Auto-Refresh — Yes
Self-Refresh — Yes
Ball Pitch — 0.8 mm

Datasheets & Resources

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