K4A8G085WB-BICR vs MT40A1G8SA-075:E Comparison

Detailed side-by-side comparison of K4A8G085WB-BICR by Samsung Electronics and MT40A1G8SA-075:E by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4A8G085WB-BICR K4A8G085WB-BICR - Samsung 8Gb DDR4 1Gx8 2400Mbps Industrial

K4A8G085WB-BICR - Samsung 8Gb DDR4 1Gx8 2400Mbps Industrial

K4A8G085WB-BICR ✓ Active
Micron Technology
MT40A1G8SA-075:E MT40A1G8SA-075:E - 8Gb DDR4 SDRAM 1.33GHz | Micron

MT40A1G8SA-075:E - 8Gb DDR4 SDRAM 1.33GHz | Micron

MT40A1G8SA-075:E ✓ Active

Specification Comparison

Parameter K4A8G085WB-BICR MT40A1G8SA-075:E
Brand Samsung Electronics Micron Technology
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $4.25 $6.30
Memory Type DDR4 SDRAM SDRAM - DDR4
Density 8 Gb —
Organization 1G x 8 —
Data Rate 2400 Mbps 2666 MT/s
Supply Voltage 1.2 V (VDD/VDDQ) —
Number of Banks 16 —
Refresh Cycles 8192 —
Package 78-ball FBGA 78-FBGA (7.5x11 mm)
Pin Count 78 —
Mounting Type Surface Mount Surface Mount
Temperature Grade Industrial (I-grade) —
Operating Temperature Range [DATA_NEEDED: exact temperature range for BICR industrial suffix] 0°C to +95°C
Die / Process Samsung 8Gb B-die DDR4 —
Speed Grade DDR4-2400 (PC4-19200) —
RoHS Status Compliant Compliant
Lead-Free Yes —
Refresh Management Row refresh, auto-refresh and self-refresh supported —
Memory Size — 8Gbit (1G x 8)
Interface — Parallel
Clock Frequency — 1.33 GHz
Supply Voltage (VDD/VDDQ) — 1.2V ±60mV
VPP Supply Voltage — 2.5V (-125mV, +250mV)
Refresh Time — 64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C to 105°C
Write Leveling — Supported
Dynamic On-Chip Termination — Supported
CRC Function — Supported
Data Mask Function — Supported

Datasheets & Resources

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