K4AAG165WM-BCWE vs K4AAG165WM-BCRC Comparison
Detailed side-by-side comparison of K4AAG165WM-BCWE by Samsung Electronics and K4AAG165WM-BCRC by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4AAG165WM-BCRC - 16Gb DDR4 x16 SDRAM 3200Mbps | Samsung
K4AAG165WM-BCRC ✓ ActiveSpecification Comparison
| Parameter | K4AAG165WM-BCWE | K4AAG165WM-BCRC |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | DRAM | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $54.65 | $22.60 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | 16 Gb |
| Organization | 256M x 16 (1G x 16) | 1G x 16 |
| Data Rate | 3200 Mbps | 3200 Mbps |
| Interface | Parallel (DDR4) | DDR4 (SSTL-12) |
| Supply Voltage VDD | 1.2 V | — |
| Supply Voltage VDDQ | 1.2 V | — |
| Access Time (Clock Cycle Time) | [DATA_NEEDED: tCK for BCWE bin] | — |
| CAS Latency | [DATA_NEEDED: CL at 3200 Mbps] | — |
| Bank Groups | 4 (x16 configuration) | — |
| Burst Length | 8 | — |
| Package | 78-ball FBGA | 96-ball FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | [DATA_NEEDED: temperature range for WM-BCWE] | [DATA_NEEDED: operating temperature range for K4AAG165WM-BCRC] |
| Die Revision | W (WM suffix) | — |
| RoHS Status | Compliant | Compliant |
| Operating Frequency | 1600 MHz (DDR, 3200 Mbps) | — |
| Supply Voltage (VDD) | — | 1.2 V |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| Data Mask Function | — | Yes |
| CAS Latency (CL) | — | [DATA_NEEDED: CAS latency at 3200 Mbps] |