K4B4G1646E-BYK0 vs K4B4G1646E-BYMATCV Comparison
Detailed side-by-side comparison of K4B4G1646E-BYK0 by Samsung Electronics and K4B4G1646E-BYMATCV by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4B4G1646E-BYMATCV - 4Gb DDR3L SDRAM 96-FBGA | Samsung
K4B4G1646E-BYMATCV ✓ ActiveSpecification Comparison
| Parameter | K4B4G1646E-BYK0 | K4B4G1646E-BYMATCV |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1.80 | $5.90 |
| Memory Type | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gb | — |
| Organization | 256M x 16 | — |
| Supply Voltage | 1.35 V (1.283 V to 1.45 V) | 1.35 V |
| Data Rate | DDR3-1600 (800 MHz) | 1866 Mbps |
| Package | 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) | 96-ball FBGA |
| Operating Temperature | 0°C to +95°C (TC) | — |
| CAS Latency | 11 (CL-tRCD-tRP) | Programmable (e.g., 13, 12, 11) |
| Burst Length | 8 (fixed), 4 (burst chop) | 8 (with burst chop 4) |
| On-Die Termination | Yes (dynamic ODT) | — |
| ZQ Calibration | Yes | — |
| Auto Precharge | Yes | Yes |
| Self-Refresh | Yes | Yes |
| Asynchronous Reset | Yes | — |
| Data Mask | Yes | — |
| RoHS | Compliant | — |
| Memory Size | — | 4 Gbit (256M x 16) |
| I/O Voltage (VDDQ) | — | 1.35 V |
| Number of Pins | — | 96 |
| Operating Temperature Range | — | -40°C to +95°C |
| Number of Banks | — | 8 |
| On-Die Termination (ODT) | — | Yes |
| RoHS Status | — | Compliant |