M1AFS1500-FGG676I vs M1AFS1500-1FGG676 Comparison

Detailed side-by-side comparison of M1AFS1500-FGG676I by Microchip Technology and M1AFS1500-1FGG676 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M1AFS1500-FGG676I M1AFS1500-FGG676I - 1.5M Gate Fusion FPGA 676FBGA | Microchip

M1AFS1500-FGG676I - 1.5M Gate Fusion FPGA 676FBGA | Microchip

M1AFS1500-FGG676I ✓ Active
Microchip Technology
M1AFS1500-1FGG676 M1AFS1500-1FGG676 - Fusion FPGA 1.5M Gates 676-FBGA | Microchip

M1AFS1500-1FGG676 - Fusion FPGA 1.5M Gates 676-FBGA | Microchip

M1AFS1500-1FGG676 ✓ Active

Specification Comparison

Parameter M1AFS1500-FGG676I M1AFS1500-1FGG676
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $89.90 $0.00
Family Fusion (Mixed-Signal FPGA) —
System Gates 1500000 —
Technology 130 nm Flash-based 130 nm CMOS flash-based
User I/O 252 —
Core Supply Voltage 1.425 V to 1.575 V (1.5 V nominal) 1.5 V
Package 676-ball FBGA (27 x 27 mm) —
Operating Temperature -40C to +100C (Industrial) —
Configuration Flash-based, single-chip, live-at-power-up —
Max Frequency 1098.9 MHz (system-level per distributor listing) —
Mounting Type Surface Mount —
Data Stream Support 8, 16, and 32 bit —
Analog Peripherals Integrated mixed-signal (ADC, voltage/temperature monitoring) —
Moisture Sensitivity Level [DATA_NEEDED: MSL Level] —
RoHS Status Compliant unknown
Speed Grade Standard (no dash speed suffix) -1
Junction Temperature Range [DATA_NEEDED: TJ range] —
Manufacturer Part Number — M1AFS1500-1FGG676
Series — M1AFS1500 (Fusion)
Number of Equivalent Gates — 1,500,000 gates
Number of Logic Cells — 38,400
Maximum Clock Frequency — 350 MHz
Number of I/O — 252 I/O
Package / Case — FBGA-676 (676-ball BGA, 1.00 mm ball pitch)
Mounting Style — SMD/SMT
Minimum Operating Temperature — 0 C
Maximum Operating Temperature — +70 C
Packaging — Tray
Configuration Memory — Flash (non-volatile, live at power-up)
Analog Integration — Configurable analog blocks (mixed-signal Fusion architecture)

Datasheets & Resources

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