M1AFS1500-FGG676I vs M1AFS1500-1FGG676 Vergleich
Detaillierter Direktvergleich von M1AFS1500-FGG676I von Microchip Technology und M1AFS1500-1FGG676 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS1500-FGG676I - 1.5M Gate Fusion FPGA 676FBGA | Microchip
M1AFS1500-FGG676I ✓ AktivMicrochip Technology
M1AFS1500-1FGG676 - Fusion FPGA 1.5M Gates 676-FBGA | Microchip
M1AFS1500-1FGG676 ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS1500-FGG676I | M1AFS1500-1FGG676 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $89,90 | $0,00 |
| Family | Fusion (Mixed-Signal FPGA) | — |
| System Gates | 1500000 | — |
| Technology | 130 nm Flash-based | 130 nm CMOS flash-based |
| User I/O | 252 | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Gehäuse | 676-ball FBGA (27 x 27 mm) | — |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Configuration | Flash-based, single-chip, live-at-power-up | — |
| Max Frequency | 1098.9 MHz (system-level per distributor listing) | — |
| Montageart | Surface Mount | — |
| Data Stream Support | 8, 16, and 32 bit | — |
| Analog Peripherals | Integrated mixed-signal (ADC, voltage/temperature monitoring) | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| RoHS-Status | Compliant | unknown |
| Speed Grade | Standard (no dash speed suffix) | -1 |
| Junction Temperature Range | [DATA_NEEDED: TJ range] | — |
| Manufacturer Part Number | — | M1AFS1500-1FGG676 |
| Series | — | M1AFS1500 (Fusion) |
| Number of Equivalent Gates | — | 1,500,000 gates |
| Number of Logic Cells | — | 38,400 |
| Maximale Taktfrequenz | — | 350 MHz |
| Number of I/O | — | 252 I/O |
| Gehäuse / Bauform | — | FBGA-676 (676-ball BGA, 1.00 mm ball pitch) |
| Montagestil | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Packaging | — | Tray |
| Configuration Memory | — | Flash (non-volatile, live at power-up) |
| Analog Integration | — | Configurable analog blocks (mixed-signal Fusion architecture) |