M1AFS250-1FG256 vs M1AFS250-1FGG256I Comparison

Detailed side-by-side comparison of M1AFS250-1FG256 by Microchip Technology and M1AFS250-1FGG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M1AFS250-1FG256 M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS250-1FG256 ✓ Active
Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ Active

Specification Comparison

Parameter M1AFS250-1FG256 M1AFS250-1FGG256I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $117.83 $0.00
Family Fusion (M1 series, mixed-signal FPGA) —
System Gates 250000 gates 250,000 gates
Processor Core ARM Cortex-M1 ARM Cortex-M1 (optional ARM support, M1 variant)
User I/O 114 —
User Flash Memory 36864 bits —
Core Supply Voltage 1.5 V —
Technology 130 nm flash-based 130-nm, 7-layer metal, flash-based CMOS
Maximum Performance 1282.05 MHz (per FindIC spec summary) —
Configuration Flash-based, live at power-up —
Security 128-bit flash lock, AES decryption 128-bit flash-based lock, AES decryption
Package 256-LBGA (FG256) —
Mounting Type Surface Mount —
Analog Blocks Integrated configurable analog (Fusion) —
Clock Management Integrated clock generation and management circuitry —
Operating Temperature [DATA_NEEDED: operating temperature range] —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Series — M1AFS250 (Fusion)
Logic Cells — 6144
Total SRAM/Flip-Flop Bits (DigiKey listing) — 36864
Number of I/O — 114
Maximum System Frequency — 350 MHz
Configuration Memory — Nonvolatile flash (Live at Power-Up, LAPU)
Operating Supply Voltage — 1.5 V
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Package / Case — 256-LBGA (FBGA), 1.00 mm ball pitch
Mounting Style — SMD/SMT
Packaging — Tray
Mixed-Signal Features — Configurable analog, flash memory blocks, clock generation and management
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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