M1AFS250-1FG256 vs M1AFS250-1FGG256I Сравнение
Подробное сравнение бок о бок M1AFS250-1FG256 от Microchip Technology и M1AFS250-1FGG256I от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Microchip Technology
M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS250-1FG256 ✓ АктивенMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ АктивенСравнение характеристик
| Параметр | M1AFS250-1FG256 | M1AFS250-1FGG256I |
|---|---|---|
| Бренд | Microchip Technology | Microchip Technology |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $117,83 | $0,00 |
| Family | Fusion (M1 series, mixed-signal FPGA) | — |
| System Gates | 250000 gates | 250,000 gates |
| Processor Core | ARM Cortex-M1 | ARM Cortex-M1 (optional ARM support, M1 variant) |
| User I/O | 114 | — |
| User Flash Memory | 36864 bits | — |
| Core Supply Voltage | 1.5 V | — |
| Technology | 130 nm flash-based | 130-nm, 7-layer metal, flash-based CMOS |
| Maximum Performance | 1282.05 MHz (per FindIC spec summary) | — |
| Configuration | Flash-based, live at power-up | — |
| Security | 128-bit flash lock, AES decryption | 128-bit flash-based lock, AES decryption |
| Корпус | 256-LBGA (FG256) | — |
| Тип монтажа | Surface Mount | — |
| Analog Blocks | Integrated configurable analog (Fusion) | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| Рабочая температура | [DATA_NEEDED: operating temperature range] | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | M1AFS250 (Fusion) |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Configuration Memory | — | Nonvolatile flash (Live at Power-Up, LAPU) |
| Рабочее напряжение питания | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Корпус / Типоразмер | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Способ монтажа | — | SMD/SMT |
| Packaging | — | Tray |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |