M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
MPN: M1AFS250-1FGG256I ✓ Active| Qty | Unit Price | Extended |
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| 500 | $0 | $0.00 |
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Drop-in alternatives for M1AFS250-1FGG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M1AFS250-FGG256I
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View Datasheet →M1AFS250-2FGG256I
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View Datasheet →M1AFS250-2FG256I
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View Datasheet →M1AFS250-1FGG256I Maximum Ratings & Electrical Characteristics
| Series | M1AFS250 (Fusion) |
| System Gates | 250,000 gates |
| Logic Cells | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | 36864 |
| Number of I/O | 114 |
| Maximum System Frequency | 350 MHz |
| Processor Core | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | 130-nm, 7-layer metal, flash-based CMOS |
| Configuration Memory | Nonvolatile flash (Live at Power-Up, LAPU) |
| Security | 128-bit flash-based lock, AES decryption |
| Operating Supply Voltage | 1.5 V |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Package / Case | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Mounting Style | SMD/SMT |
| Packaging | Tray |
| Mixed-Signal Features | Configurable analog, flash memory blocks, clock generation and management |
M1AFS250-1FGG256I 256-lbga (fbga), 1.00 mm ball pitch Pin Configuration Guide
Complete pinout information for M1AFS250-1FGG256I (256-lbga (fbga), 1.00 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS250-1FGG256I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS250-1FGG256I is suitable for 6 applications: Industrial Automation Control, Smart Power Management, Portable and Battery-Powered Instrumentation, Motor Drive Supervision, Security and IP-Protected Systems, Aerospace and Defense Subsystems.
Industrial Automation Control
In factory automation nodes such as PLC I/O modules, sensor-hub controllers, and machine-interlock logic, the M1AFS250-1FGG256I's flash-based, Live-at-Power-Up fabric means control logic is functional the instant power is applied - critical for safety interlocks that must not wait for a configuration load. The 114 user I/O accommodate dense digital I/O expansion, while the integrated configurable analog blocks digitize sensor signals (temperature, current shunts) without an external ADC, cutting component count on the 256-FBGA board. The ARM Cortex-M1 handles protocol stacks while the fabric manages deterministic I/O timing up to 350 MHz system performance. Its industrial -40C to +85C rating and AES-protected flash configuration suit deployed equipment where firmware IP must be secured against cloning.
Recommended
Smart Power Management
The Fusion architecture was explicitly designed to integrate configurable analog, flash memory, clock management, and programmable logic in one monolithic device, which makes the M1AFS250-1FGG256I a strong fit for power-supply supervision, sequencing, and monitoring boards. Its analog blocks can monitor voltage rails and currents on-chip, while fabric state machines enforce power-up sequencing - and because the device is nonvolatile and Live at Power-Up, sequencing logic is active before an SRAM FPGA or processor would even finish booting. Operation from a 1.5 V core with industrial temperature rating -40C to +85C supports embedded power shelves and 48 V distribution monitoring front-ends. Single-chip integration replaces discrete supervisor ICs, comparators, and a small CPLD, shrinking PCB area in dense power systems.
Recommended
Portable and Battery-Powered Instrumentation
Handheld instruments benefit from the M1AFS250-1FGG256I's single-chip integration: flash configuration removes the external boot memory, the analog blocks replace a separate measurement ADC, and the ARM Cortex-M1 runs the user interface and communication firmware while fabric logic handles real-time acquisition. The 256-ball FBGA with 1.00 mm pitch conserves board area, and instant-on behavior gives users an immediately responsive instrument after power switch closure. The 128-bit flash lock with AES decryption protects calibration routines and proprietary algorithms stored in the nonvolatile configuration, an important concern for commercial handheld products. With 36864 listed memory bits and 6144 logic cells, the fabric buffers measurement samples and implements display and sensor interfaces without external glue logic.
Recommended
Motor Drive Supervision
Motor-drive control boards use the M1AFS250-1FGG256I as a supervision and protection companion: fabric logic monitors gate-driver feedback and current-sense signals via the on-chip analog comparators and ADC channels, implementing fast fault latching within nanoseconds of a fault event. Because the device is Live at Power-Up, protection logic is armed before the main DSP or MCU boots, closing a dangerous window at power-on. The industrial -40C to +85C temperature range matches inverter cabinet environments, and the 114 I/O interface PWM, encoder, and communication signals without external buffers. The 350 MHz fabric capability supports high-resolution PWM counting and quadrature decoding concurrently with the supervision state machine on a single 1.5 V-core chip.
Recommended
Security and IP-Protected Systems
Systems that must protect programmed intellectual property leverage the M1AFS250-1FGG256I's built-in security: a 128-bit flash-based lock and industry-leading AES decryption secure configuration data, so cloned or read-back attacks cannot recover the bitstream. Applications include encryption keys management, authentication daughtercards, anti-tamper front-ends, and license-controlled peripherals. Unlike SRAM FPGAs, whose bitstreams must be stored externally in the clear or encrypted at boot time, the Fusion flash configuration remains on-chip and nonvolatile, shrinking the attack surface and removing the boot-time plaintext window. Instant-on operation and the industrial temperature range further suit always-on security appliances deployed from -40C to +85C in uncontrolled environments.
Recommended
Aerospace and Defense Subsystems
Flash-based, single-chip FPGAs have long been favored in defense and aerospace subsystems - satellite payload interfaces, telemetry encoders, and test-set controllers - because nonvolatile configuration tolerates radiation-induced configuration upsets better than SRAM fabrics and requires no boot PROM. The M1AFS250-1FGG256I contributes LAPU instant-on behavior for systems that must wake and operate immediately on power application, plus AES-encrypted configuration protecting mission IP. The 130-nm flash CMOS process with 7-layer metal provides a stable, qualified fabric, and the 256-FBGA footprint is shared across the Microchip RTAX and Fusion families available on XAIPART, giving procurement teams a path to rad-tolerant RTAX parts (e.g., RTAX2000S) when program requirements escalate.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS250-1FGG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS250-FGG256I | M1AFS250-FGG256 | M1AFS250-2FGG256I | M1AFS250-2FG256I |
|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA, 1.00 mm pitch) | 256-FBGA FGG256 - same footprint | 256-FBGA FGG256 - same footprint | 256-FBGA FGG256 - same footprint | 256-FBGA FG256 - same footprint, legacy finish |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Speed Grade | -1 | [DATA_NEEDED: speed grade] | [DATA_NEEDED: speed grade] | -2 (faster) | -2 (faster) |
| Number of I/O | 114 | 114 | 114 | 114 | 114 |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | 0C to +70C (commercial) | -40C to +85C | -40C to +85C |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Memory | Nonvolatile flash, LAPU, AES-secured | Nonvolatile flash, LAPU, AES-secured | Nonvolatile flash, LAPU, AES-secured | Nonvolatile flash, LAPU, AES-secured | Nonvolatile flash, LAPU, AES-secured |
Key Differentiators
- Instant-on nonvolatile operation (vs SRAM FPGAs (e.g., Xilinx/Altera equivalents))
- Integrated mixed-signal fabric (vs M1AFS250-2FGG256I)
- Industrial temperature rating with lead-free package (vs M1AFS250-FGG256 (commercial grade))
Design Notes
The 256-ball FBGA uses a 1.00 mm ball pitch, requiring a fine-pitch PCB process: typical escape routing uses 0.10-0.13 mm traces with via-in-pad or dogbone escapes on the outer rows, while inner balls need microvia or buried-via stackups. Verify the exact land pattern against the Microchip Fusion datasheet mechanical drawing before fabrication. Since all M1AFS250 FGG256 speed grades share the same ball map, design the footprint once and qualify any family variant - this de-risks speed-grade or lead-finish (FG vs FGG) substitutions during shortages.
The core operates from 1.5 V; I/O banks and analog blocks use separate supplies that must be sequenced and decoupled per the Microchip Fusion power-supply guidelines. Provide dedicated ferrite-isolated rails or LDOs for the analog blocks so on-chip ADC/comparator accuracy is not degraded by core switching noise. Because Fusion devices are Live at Power-Up, ensure rail ramp monotonicity meets datasheet requirements - non-monotonic ramps can produce indeterminate I/O states during the instant-on window, which matters in sequencing/protection applications.
Do not assume the M1AFS250 can be replaced by SRAM FPGA families without redesign: the Fusion analog blocks and flash configuration architecture are proprietary, and Live-at-Power-Up behavior disappears in SRAM alternatives requiring boot devices. Also confirm temperature grade in the ordering code - 'I' suffix parts are -40C to +85C industrial, while commercial-grade variants (no 'I') are unsuitable for industrial deployments. Finally, when substituting speed grades, rerun static timing analysis in Libero; a design passing on grade -2 will pass on grade -1 only with timing margin.
Compliance Information
The FGG package suffix generally denotes lead-free (RoHS) ball finish per Microchip convention, but explicit RoHS/REACH declarations were not present in the provided verified data - confirm on the Microchip product page compliance section before purchase.
