M1AFS250-1FG256I vs M1AFS250-2FGG256I Comparison
Detailed side-by-side comparison of M1AFS250-1FG256I by Microchip Technology and M1AFS250-2FGG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ ActiveMicrochip Technology
M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-2FGG256I ✓ ActiveSpecification Comparison
| Parameter | M1AFS250-1FG256I | M1AFS250-2FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $96.50 | $83.12 |
| Series | Fusion (M1 - with ARM Cortex-M1) | — |
| System Gates | 250000 gates | 250000 gates |
| D Flip-Flops (DFF) | 36864 | — |
| Total I/O | 114 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V |
| Configuration Type | Flash-based (live at power-up) | — |
| Embedded Processor | ARM Cortex-M1 soft core | ARM Cortex-M1 |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| On-chip Memory | Flash memory blocks | — |
| Operating Temperature | -40C to +85C (industrial, suffix I) | -40C to +85C (industrial, I grade) |
| Speed Grade | -1 | -2 |
| Package | 256-LBGA (FBGA) | 256-ball FBGA (FGG256) |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height | — |
| Mounting Type | Surface Mount | Surface Mount |
| Supplier Device Package | 256-LBGA | — |
| Total RAM | [DATA_NEEDED: Total RAM bits] | — |
| Embedded Block RAM (eSRAM) | [DATA_NEEDED: eSRAM size] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Family | — | Actel Fusion (Mixed-Signal FPGA) |
| Registers (DFFs) | — | 36864 |
| User I/Os | — | 114 |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm, 7-layer metal CMOS |
| System Performance | — | Up to 350 MHz |
| Security | — | 128-bit Flash lock, AES decryption |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| RoHS Status | — | Compliant (FGG = Pb-free balls) |